18229446. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18229446 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the patent application includes a substrate with a solder resist layer, a semiconductor chip mounted on the substrate, and a bump structure connecting the substrate to the semiconductor chip.
- The substrate extends in two directions and has an open area on the solder resist layer.
- The semiconductor chip is positioned on the substrate with one surface facing it.
- The bump structure connects a connection pad on the open area of the substrate to a connection pad on the surface of the semiconductor chip.
- The open area on the substrate includes a larger first area and a smaller second area in the peripheral part of the first area.
Potential Applications
- Semiconductor packaging industry
- Electronics manufacturing
Problems Solved
- Improved connection between substrate and semiconductor chip
- Enhanced reliability of semiconductor packages
Benefits
- Better performance and durability of electronic devices
- Increased efficiency in manufacturing processes
Original Abstract Submitted
A semiconductor package, including a substrate extending in first direction and a second direction intersecting the first direction and including a solder resist layer having an open area thereon; a semiconductor chip on the substrate in a third direction, the third direction intersecting the first direction and the second direction, a first surface of the semiconductor chip facing the substrate; and a bump structure in contact with a first connection pad on the open area and a second connection pad on the first surface of the semiconductor chip, and configured to connect the substrate to the semiconductor chip, wherein the open area includes a first area and a second area disposed in a peripheral part of the first area, and wherein a length of the first area in the first direction is greater than a length of the second area in the first direction.
