18225768. COATING COMPOSITION FOR WAFER PROTECTION AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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COATING COMPOSITION FOR WAFER PROTECTION AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Woojung Park of Suwon-si (KR)

Mihyae Park of Suwon-si (KR)

COATING COMPOSITION FOR WAFER PROTECTION AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18225768 titled 'COATING COMPOSITION FOR WAFER PROTECTION AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME

Simplified Explanation

The abstract describes a coating composition for wafer protection and a method of manufacturing a semiconductor package. The coating composition includes a solvent, a water-soluble polymer, and a nano light-emitting filler.

  • The coating composition is used for protecting wafers in the semiconductor manufacturing process.
  • The composition contains a solvent, which helps in the application of the coating.
  • It also includes a water-soluble polymer, which provides adhesion and protection to the wafer surface.
  • The composition further contains a nano light-emitting filler, which enhances the functionality of the coating.
  • The method of manufacturing a semiconductor package involves applying the coating composition onto the wafer surface.
  • The coating composition can be applied using various techniques such as spin coating or spray coating.
  • The coated wafer is then subjected to curing or drying to form a protective layer.
  • The resulting semiconductor package has improved protection against environmental factors and enhanced functionality.

Potential applications of this technology:

  • Semiconductor manufacturing industry: The coating composition can be used in the production of semiconductor packages to protect wafers during the manufacturing process.
  • Electronics industry: The technology can be applied to protect electronic components and devices from environmental factors, improving their durability and performance.

Problems solved by this technology:

  • Wafer protection: The coating composition provides a protective layer on wafers, preventing damage from moisture, dust, and other contaminants.
  • Enhanced functionality: The nano light-emitting filler in the composition enhances the functionality of the coating, potentially enabling additional features or capabilities in semiconductor packages and electronic devices.

Benefits of this technology:

  • Improved protection: The coating composition offers enhanced protection to wafers and electronic components, increasing their lifespan and reliability.
  • Versatile application: The technology can be applied to various substrates and surfaces, making it suitable for different industries and applications.
  • Enhanced functionality: The inclusion of a nano light-emitting filler in the composition adds functionality to the coating, potentially enabling new features or applications in semiconductor packages and electronic devices.


Original Abstract Submitted

A coating composition for wafer protection and a method of manufacturing a semiconductor package, the coating composition includes a solvent; about 1 weight percent (wt %) to about 40 wt % of a water-soluble polymer; and about 0.01 wt % to about 30 wt % of a nano light-emitting filler.

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