18222567. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 SEMICONDUCTOR PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18222567 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the patent application involves semiconductor structures stacked in a stepwise manner, with each structure consisting of a lower structure, an upper structure, and an insulating layer on the bottom surface of the upper structure that contacts the side surfaces of the lower structure. The lower structure may have a smaller area than the upper structure in plan view, and the side surface of the insulating layer aligns vertically with the side surface of the upper structure.
- Lower structure, upper structure, and insulating layer in semiconductor package
- Lower structure may have smaller area than upper structure in plan view
- Insulating layer contacts side surfaces of lower structure and aligns vertically with upper structure
Potential Applications
The technology described in the patent application could be applied in:
- Semiconductor manufacturing
- Electronics industry
- Integrated circuit design
Problems Solved
This technology helps address issues such as:
- Improving thermal management in semiconductor devices
- Enhancing electrical insulation between stacked structures
- Optimizing space utilization in semiconductor packages
Benefits
The benefits of this technology include:
- Increased efficiency in semiconductor device performance
- Enhanced reliability and durability of semiconductor packages
- Potential for miniaturization and cost reduction in electronic devices
Potential Commercial Applications
The semiconductor package innovation could find commercial applications in:
- Mobile devices
- Automotive electronics
- Industrial automation systems
Possible Prior Art
One possible prior art related to this technology is the use of insulating layers in semiconductor packaging to improve thermal and electrical properties.
Unanswered Questions
How does this technology compare to existing semiconductor packaging methods in terms of cost-effectiveness?
The article does not provide information on the cost implications of implementing this technology compared to traditional semiconductor packaging methods.
What are the specific materials used in the insulating layer and how do they impact the overall performance of the semiconductor package?
The article does not delve into the specific materials used in the insulating layer and their effects on the semiconductor package's performance.
Original Abstract Submitted
A semiconductor package includes semiconductor structures stacked in a stepwise manner. Each of the semiconductor structures may include a lower structure, an upper structure on the lower structure, and an insulating layer provided on a bottom surface of the upper structure to be in contact with at least a portion of side surfaces of the lower structure. An area of the lower structure may be smaller than an area of the upper structure, when viewed in a plan view, and a side surface of the insulating layer may be vertically aligned to a side surface of the upper structure.
