18219494. SUBSTRATE INSPECTION METHOD simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SUBSTRATE INSPECTION METHOD
Organization Name
Inventor(s)
Seungryeol Oh of Suwon-si (KR)
SUBSTRATE INSPECTION METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18219494 titled 'SUBSTRATE INSPECTION METHOD
Simplified Explanation
The abstract describes a method for inspecting a substrate by radiating light onto it, extracting a spectrum representing the intensity of the reflected light according to its wavelength, analyzing the spectrum in units of the entire substrate, shot, chip, and block, generating a spectrum distribution map indicating reflectivity for each wavelength band based on the analyzed spectrum, and extracting a weak point in the substrate based on the spectrum distribution map.
- The method involves radiating light onto a substrate and analyzing the reflected light.
- A spectrum representing the intensity of the reflected light is extracted based on its wavelength.
- The extracted spectrum is analyzed in units of the entire substrate, shot, chip, and block.
- A spectrum distribution map is generated to indicate reflectivity for each wavelength band.
- The weak points in the substrate can be identified based on the spectrum distribution map.
Potential applications of this technology:
- Quality control in manufacturing processes: This method can be used to inspect substrates for any weak points or defects, ensuring the quality of the manufactured products.
- Semiconductor industry: The method can be applied to inspect semiconductor substrates for any flaws or weak points that could affect the performance of the chips.
- Material science research: Researchers can use this method to analyze the reflectivity of different materials and study their properties.
Problems solved by this technology:
- Detection of weak points: The method allows for the identification of weak points or defects in substrates, which can be crucial for ensuring the reliability and functionality of various products.
- Non-destructive inspection: By using light to inspect the substrate, this method offers a non-destructive way of identifying weak points without causing any damage to the material.
Benefits of this technology:
- Improved quality control: The method provides a reliable and efficient way to inspect substrates, allowing for the detection of weak points and defects early in the manufacturing process.
- Cost and time savings: By identifying weak points before further processing, potential waste and rework can be minimized, leading to cost and time savings in production.
- Non-destructive inspection: The use of light for inspection eliminates the need for destructive testing methods, preserving the integrity of the substrate and reducing material waste.
Original Abstract Submitted
A substrate inspection method includes radiating light onto a substrate, extracting a spectrum representing an intensity of light according to a wavelength from a light reflected from the substrate, analyzing the extracted spectrum in units of each of an entire substrate, a shot, a chip, and a block, generating a spectrum distribution map indicating reflectivity for each wavelength band by using the analyzed spectrum, and extracting a weak point in the substrate based on the spectrum distribution map.
