18213851. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
- 1 SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Organization Name
Inventor(s)
UN-BYOUNG Kang of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18213851 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Simplified Explanation
The semiconductor package described in the patent application comprises a base semiconductor chip, a chip structure, a connection terminal, and a molding layer. The chip structure includes two semiconductor chips with overlapping backside and frontside pads made of the same metal, forming a single unitary piece.
- The semiconductor package includes a base semiconductor chip, a chip structure, a connection terminal, and a molding layer.
- The chip structure consists of two semiconductor chips with overlapping backside and frontside pads made of the same metal, forming a single unitary piece.
Potential Applications
The technology described in this patent application could be applied in various electronic devices such as smartphones, tablets, laptops, and other consumer electronics that require compact and efficient semiconductor packaging.
Problems Solved
This technology solves the problem of optimizing space and improving the performance of semiconductor packages by integrating multiple chips into a single unitary piece with overlapping pads.
Benefits
The benefits of this technology include increased efficiency, reduced size, improved performance, and enhanced reliability of semiconductor packages.
Potential Commercial Applications
- "Innovative Semiconductor Packaging Technology for Enhanced Performance and Reliability"
Possible Prior Art
There may be prior art related to semiconductor packaging techniques that involve integrating multiple chips into a single unitary piece with overlapping pads. However, specific examples are not provided in the patent application.
Unanswered Questions
How does this technology compare to existing semiconductor packaging methods in terms of cost-effectiveness?
The patent application does not provide information on the cost-effectiveness of this technology compared to existing semiconductor packaging methods.
What are the potential challenges or limitations of implementing this technology in mass production?
The patent application does not address the potential challenges or limitations of implementing this technology in mass production.
Original Abstract Submitted
Disclosed are semiconductor packages and their fabrication methods. The semiconductor package comprises a base semiconductor chip, a chip structure on the base semiconductor chip, a connection terminal between the base semiconductor chip and the chip structure, and a molding layer surrounding the chip structure and the connection terminal. The chip structure includes a first semiconductor chip including a first frontside pad and a first backside pad, and a second semiconductor including a second frontside pad and a second backside pad. A lateral surface of the first semiconductor chip is aligned with that of the second semiconductor chip. The first backside pad and the second frontside pad partially overlap each other when viewed in plan while being in direct contact with each other. The first backside pad and the second frontside pad include the same metal and are formed into a single unitary piece.
