18210107. SUBSTRATE POLISHING APPARATUS AND METHOD OF POLISHING SUBSTRATE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
SUBSTRATE POLISHING APPARATUS AND METHOD OF POLISHING SUBSTRATE USING THE SAME
Organization Name
Inventor(s)
Donghoon Kwon of Suwon-si (KR)
SUBSTRATE POLISHING APPARATUS AND METHOD OF POLISHING SUBSTRATE USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18210107 titled 'SUBSTRATE POLISHING APPARATUS AND METHOD OF POLISHING SUBSTRATE USING THE SAME
Simplified Explanation
The patent application describes a substrate polishing apparatus that includes various components to improve the polishing process. These components include a polishing pad with a magnetic material, a platen, a slurry supply unit, a conditioner, a polishing head, and a magnetic module.
- The polishing pad is made of a magnetic material and is attached to the upper surface of the platen.
- The slurry supply unit is installed on the polishing pad to provide slurry during the polishing process.
- The conditioner is installed on the polishing pad and is used to fine-polish the surface of the polishing pad.
- The polishing head is also installed on the polishing pad and is used to rotate the polishing target.
- The magnetic module is installed on the polishing pad between the conditioner and the polishing head. It applies magnetic force to remove debris from the polishing pad.
Potential applications of this technology:
- Semiconductor manufacturing: This substrate polishing apparatus can be used in the production of semiconductor devices to polish substrates and remove debris effectively.
- Optics manufacturing: The apparatus can also be used in the manufacturing of optical components, such as lenses and mirrors, to achieve high-quality surface finishes.
- Metalworking: The magnetic module can be beneficial in metal polishing processes, improving efficiency and reducing the need for manual cleaning.
Problems solved by this technology:
- Efficient debris removal: The magnetic module helps remove debris from the polishing pad, preventing it from affecting the polishing process and potentially damaging the substrate.
- Improved polishing quality: The combination of the magnetic module, slurry supply unit, and conditioner allows for better control over the polishing process, resulting in higher-quality finishes.
- Reduced maintenance: The magnetic module reduces the need for manual cleaning of the polishing pad, saving time and effort.
Benefits of this technology:
- Enhanced productivity: The substrate polishing apparatus improves the efficiency of the polishing process, leading to increased productivity in manufacturing operations.
- Cost savings: By reducing the need for manual cleaning and improving polishing quality, this technology can help save costs associated with maintenance and rework.
- Consistent results: The apparatus provides better control over the polishing process, ensuring consistent and reliable results for various applications.
Original Abstract Submitted
A substrate polishing apparatus includes a polishing pad including a magnetic material, a platen having an upper surface to which the polishing pad is attached, a slurry supply unit installed on the polishing pad, a conditioner installed on the polishing pad to be spaced apart from the slurry supply unit in the one direction and configured to fine-polish a surface of the polishing pad, a polishing head installed on the polishing pad to be spaced apart from the conditioner in the one direction and configured to rotate a polishing target, and a magnetic module installed on the polishing pad to be disposed between the conditioner and the polishing head in the one direction and configured to apply magnetic force to polishing pad debris to remove the polishing pad debris.
