18206840. Systems And Methods For Coupling Integrated Circuit Dies simplified abstract (Intel Corporation)
Contents
- 1 Systems And Methods For Coupling Integrated Circuit Dies
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Systems And Methods For Coupling Integrated Circuit Dies - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
Systems And Methods For Coupling Integrated Circuit Dies
Organization Name
Inventor(s)
Md Altaf Hossain of Portland OR (US)
Mahesh Kumashikar of Bangalore (IN)
Ankireddy Nalamalpu of Portland OR (US)
Systems And Methods For Coupling Integrated Circuit Dies - A simplified explanation of the abstract
This abstract first appeared for US patent application 18206840 titled 'Systems And Methods For Coupling Integrated Circuit Dies
Simplified Explanation
The circuit system described in the patent application involves a support device with an interconnection conductor, along with three integrated circuits mounted on the support device. The interconnection conductor connects the first integrated circuit to the third integrated circuit, with the second integrated circuit positioned between them.
- The circuit system includes a support device with an interconnection conductor.
- Three integrated circuits are mounted on the support device.
- The interconnection conductor connects the first integrated circuit to the third integrated circuit.
- The second integrated circuit is positioned between the first and third integrated circuits.
Potential Applications
This technology could be applied in:
- Electronics manufacturing
- Circuit design and development
- Semiconductor industry
Problems Solved
This technology helps in:
- Improving circuit connectivity
- Enhancing integrated circuit performance
- Streamlining circuit assembly processes
Benefits
The benefits of this technology include:
- Increased efficiency in circuit systems
- Enhanced reliability of interconnections
- Simplified circuit integration processes
Potential Commercial Applications
This technology could find commercial applications in:
- Consumer electronics
- Automotive electronics
- Telecommunications industry
Possible Prior Art
One possible prior art could be the use of multi-chip modules in circuit systems to improve connectivity and performance.
Unanswered Questions
How does this technology compare to existing circuit integration methods?
This article does not provide a direct comparison to existing circuit integration methods, leaving the reader to wonder about the specific advantages of this new system over traditional approaches.
What are the specific technical specifications of the integrated circuits used in this system?
The article does not delve into the technical specifications of the integrated circuits utilized in this system, leaving a gap in understanding the intricacies of the technology.
Original Abstract Submitted
A circuit system includes a support device having an interconnection conductor. The circuit system also includes first, second, and third integrated circuits that are mounted on the support device. The interconnection conductor couples the first integrated circuit to the third integrated circuit. The second integrated circuit is between the first integrated circuit and the third integrated circuit.
