18204556. SEMICONDUCTOR DEVICES INCLUDING INDUCTOR STRUCTURES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
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SEMICONDUCTOR DEVICES INCLUDING INDUCTOR STRUCTURES
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SEMICONDUCTOR DEVICES INCLUDING INDUCTOR STRUCTURES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18204556 titled 'SEMICONDUCTOR DEVICES INCLUDING INDUCTOR STRUCTURES
Simplified Explanation
The abstract describes a semiconductor device that includes a substrate, an element layer with circuit elements, a wiring layer, and a redistribution layer. The redistribution layer consists of a redistribution insulating layer and a redistribution conductive layer. The conductive layer includes a connection pad and two inductor structures with planar coil-shaped redistribution lines. These lines have different thicknesses.
- The semiconductor device includes multiple layers, including a substrate, element layer, wiring layer, and redistribution layer.
- The redistribution layer consists of an insulating layer and a conductive layer.
- The conductive layer includes a connection pad and two inductor structures with planar coil-shaped redistribution lines.
- The redistribution lines in the inductor structures have different thicknesses.
Potential applications of this technology:
- Integrated circuits: The semiconductor device can be used in the manufacturing of integrated circuits for various electronic devices.
- Wireless communication: The inductor structures can be utilized in wireless communication systems, such as antennas and RF circuits.
- Power electronics: The device's circuit elements and inductor structures can be employed in power electronics applications, such as voltage regulators and inverters.
Problems solved by this technology:
- Space optimization: The planar coil-shaped redistribution lines allow for efficient use of space on the semiconductor device.
- Circuit integration: The multiple layers and circuit elements enable the integration of various functions within a single device.
- Signal integrity: The redistribution layer helps in maintaining signal integrity by providing proper wiring and connections.
Benefits of this technology:
- Improved performance: The use of inductor structures and redistribution lines enhances the performance of the semiconductor device in terms of signal transmission and power handling.
- Miniaturization: The compact design and efficient use of space contribute to the miniaturization of electronic devices.
- Cost-effectiveness: The integration of multiple functions within a single device reduces the need for additional components, leading to cost savings in manufacturing.
Original Abstract Submitted
A semiconductor device may include a substrate, an element layer including circuit elements arranged on the substrate, a wiring layer on the element layer, and a redistribution layer on the wiring layer. The redistribution layer may include a redistribution insulating layer and a redistribution conductive layer on the redistribution insulating layer. The redistribution conductive layer may include a connection pad and first and second inductor structures respectively including first and second inductor redistribution lines having a planar coil shape, and a connection pad. The first and second inductor redistribution lines respectively included in the first and second inductor structures may have different thicknesses.
