18202187. DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG DISPLAY CO., LTD.)

DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME

Organization Name

SAMSUNG DISPLAY CO., LTD.

Inventor(s)

Youngok Park of Yongin-si (KR)

Seungsoo Ryu of Yongin-si (KR)

Heeju Woo of Yongin-si (KR)

DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18202187 titled 'DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME

Simplified Explanation

The patent application describes a method of manufacturing a display apparatus that reduces the occurrence of short circuits. The method involves the following steps:

• Forming a pad on the substrate in the peripheral area outside the display area.
• Placing a first conductive particle on the surface of the pad.
• Placing a second conductive particle on the surface of a bump in an electronic chip package.
• Electrically connecting the pad to the bump by bringing the first conductive particle into contact with the second conductive particle.

Potential applications of this technology:

• Manufacturing of display apparatuses such as LCD screens, OLED displays, or touchscreens.
• Production of electronic devices with reduced risk of short circuits.

Problems solved by this technology:

• Short circuits can occur in display apparatuses, leading to malfunction or damage.
• The method reduces the occurrence of short circuits by providing a reliable electrical connection between the pad and the bump.

Benefits of this technology:

• Reduces the risk of short circuits in display apparatuses.
• Improves the reliability and durability of electronic devices.
• Enhances the overall performance and lifespan of display apparatuses.

Original Abstract Submitted

A method of manufacturing a display apparatus in which the occurrence of a short circuit may be reduced includes forming a pad in a peripheral area of a substrate having a display area and the peripheral area outside the display area, disposing a first conductive particle on a surface of the pad, disposing a second conductive particle on a surface of a bump included in an electronic chip package, the surface of the bump facing the surface of the pad, and electrically connecting the pad to the bump by bringing the first conductive particle into contact with the second conductive particle.