18201898. ELECTRONIC APPARATUS AND METHOD OF MANUFACTURING FOR THE SAME simplified abstract (Samsung Display Co., LTD.)

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ELECTRONIC APPARATUS AND METHOD OF MANUFACTURING FOR THE SAME

Organization Name

Samsung Display Co., LTD.

Inventor(s)

CHANGMOO Lee of Yongin-si (KR)

YOUNGDO Kim of Yongin-si (KR)

JUNEHYOUNG Park of Yongin-si (KR)

JUNWOO You of Yongin-si (KR)

SUK WON Jung of Yongin-si (KR)

ELECTRONIC APPARATUS AND METHOD OF MANUFACTURING FOR THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18201898 titled 'ELECTRONIC APPARATUS AND METHOD OF MANUFACTURING FOR THE SAME

Simplified Explanation

The electronic apparatus described in the patent application includes a display panel with a heat dissipation layer on its rear surface. The heat dissipation layer contains conductive particles dispersed in a base portion, with a density that increases from the first surface facing the rear surface to the second surface on the opposite side.

  • The electronic apparatus includes a display panel with a heat dissipation layer on its rear surface.
  • The heat dissipation layer contains conductive particles dispersed in a base portion.
  • The density of the conductive particles increases from the first surface to the second surface of the heat dissipation layer.

Potential Applications

  • Electronic devices with improved heat dissipation capabilities.
  • Displays in electronic devices that require efficient cooling mechanisms.

Problems Solved

  • Overheating issues in electronic devices with display panels.
  • Improving the longevity and performance of electronic devices.

Benefits

  • Enhanced heat dissipation for electronic devices.
  • Increased reliability and efficiency of electronic devices.
  • Improved overall performance and lifespan of electronic devices.


Original Abstract Submitted

An electronic apparatus include a display panel having a rear surface. A heat dissipation layer is disposed on the rear surface of the display panel. The heat dissipation layer includes a base portion including a first surface facing the rear surface and a second surface opposite to the first surface. Conductive particles are dispersed in the base portion. The conductive particles may be spaced apart from the first surface. A density of a distribution of the conductive particles increases from the first surface to the second surface.

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