18199035. DEVELOPING APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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DEVELOPING APPARATUS

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Sungki Lee of Suwon-si (KR)

Giljong Kim of Suwon-si (KR)

Hakdoo Kim of Anseong-si (KR)

Donggeun Hur of Anseong-si (KR)

Yoonsu Kim of Suwon-si (KR)

DEVELOPING APPARATUS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18199035 titled 'DEVELOPING APPARATUS

Simplified Explanation

The patent application describes a developing apparatus that is used in the manufacturing process of electronic devices.

  • The apparatus includes a body, a buffer plate, a vacuum plate, and a slit block.
  • The buffer plate has a gas flow path and the vacuum plate has a gas supply hole that is connected to the gas flow path.
  • The vacuum plate is designed to hold a substrate, with a contact area between the substrate and the vacuum plate being at least 90% of the substrate's area.
  • The slit block and the vacuum plate create a flow path for gas from the gas supply hole, with the slit block and the edge of the substrate forming a second flow path that is connected to the first flow path.
  • The apparatus includes a buffer space and an inclined first flow path that allows for the smooth flow of gas during the developing process.

Potential applications of this technology:

  • This developing apparatus can be used in the manufacturing of electronic devices such as semiconductors, displays, and printed circuit boards.
  • It can be used in various stages of the manufacturing process, including the development of photoresist patterns and the removal of excess materials.

Problems solved by this technology:

  • The apparatus ensures a high level of contact between the substrate and the vacuum plate, which improves the accuracy and efficiency of the developing process.
  • The buffer space and the inclined flow path help to maintain a consistent and smooth flow of gas, reducing the risk of defects or uneven development.

Benefits of this technology:

  • The high contact area between the substrate and the vacuum plate improves the quality and precision of the developing process.
  • The smooth flow of gas provided by the buffer space and the inclined flow path ensures uniform development and reduces the risk of defects.
  • The apparatus is designed to be efficient and reliable, enhancing the overall productivity of the manufacturing process.


Original Abstract Submitted

A developing apparatus includes a body; a buffer plate on the body and including a gas flow path; a vacuum plate on an upper surface of the buffer plate and having a gas supply hole in fluid communication with the gas flow path; and a slit block on an edge of the vacuum plate, the slit block and the vacuum plate forming a flow path for gas from the gas supply hole, wherein a substrate is holdable on the vacuum plate, a contact area between the substrate and the vacuum plate being 90% or more of an area of the substrate, the slit block and the vacuum plate form a buffer space and an inclined first flow path in fluid communication with the buffer space, and the slit block and an edge of the substrate forms a second flow path in fluid communication with the first flow path.