18198326. SEMICONDUCTOR PACKAGE AND DISPLAY DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE AND DISPLAY DEVICE
Organization Name
Inventor(s)
Kyoung Suk Yang of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND DISPLAY DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18198326 titled 'SEMICONDUCTOR PACKAGE AND DISPLAY DEVICE
Simplified Explanation
The semiconductor package described in the patent application includes a film, a wiring pattern layer, a semiconductor chip, insulating layers, a metal layer, and a heat dissipating layer made of a synthetic resin.
- The semiconductor chip is electrically connected to the wiring pattern layer.
- The heat dissipating layer covers the semiconductor chip to improve heat dissipation.
- The metal layer is spaced apart from the semiconductor chip to prevent interference.
Potential Applications
This technology can be applied in various electronic devices such as smartphones, laptops, and tablets to improve heat dissipation and enhance overall performance.
Problems Solved
1. Overheating issues in semiconductor devices. 2. Inefficient heat dissipation in electronic devices. 3. Limited thermal management capabilities in compact electronic devices.
Benefits
1. Improved heat dissipation function. 2. Enhanced performance and reliability of electronic devices. 3. Increased lifespan of semiconductor chips. 4. Better thermal management in compact electronic devices.
Original Abstract Submitted
There is provided a semiconductor package with improved heat dissipation function. The semiconductor package comprising, a film, a wiring pattern layer disposed on the film, and including a first area and a second area surrounding the first area, a semiconductor chip disposed on the first area of the wiring pattern layer and electrically connected to the wiring pattern layer, a first insulating layer disposed on the second area of the wiring pattern layer, a first metal layer disposed on the first insulating layer and spaced apart from the semiconductor chip and a heat dissipating layer covering the semiconductor chip and made of a synthetic resin.
