18196276. SEMICONDUCTOR PACKAGE AND IMAGE SENSOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
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SEMICONDUCTOR PACKAGE AND IMAGE SENSOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE AND IMAGE SENSOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18196276 titled 'SEMICONDUCTOR PACKAGE AND IMAGE SENSOR PACKAGE
Simplified Explanation
The abstract describes a semiconductor package that includes a package substrate, a semiconductor chip, a transparent substrate, and an adhesive layer. The adhesive layer is designed to block light and is placed between the semiconductor chip and the transparent substrate. The transparent substrate has two lower sides and a connecting inner side wall.
- The semiconductor package includes a package substrate, a semiconductor chip, a transparent substrate, and an adhesive layer.
- The adhesive layer is positioned between the semiconductor chip and the transparent substrate.
- The adhesive layer is configured to block light.
- The transparent substrate has two lower sides and a connecting inner side wall.
- The adhesive layer is in contact with the second lower side and the first inner side wall.
Potential applications of this technology:
- Optoelectronic devices: The ability of the adhesive layer to block light can be useful in optoelectronic devices such as displays, sensors, and photovoltaic cells.
- Semiconductor packaging: This technology can be applied in the packaging of semiconductor chips to enhance their performance and reliability.
Problems solved by this technology:
- Light interference: The adhesive layer helps to block light, preventing interference or unwanted effects caused by light exposure on the semiconductor chip.
- Protection: The transparent substrate and adhesive layer provide protection to the semiconductor chip from external factors such as dust, moisture, and mechanical stress.
Benefits of this technology:
- Improved performance: By blocking light and providing protection, the technology can improve the performance and reliability of semiconductor chips.
- Versatility: The transparent substrate and adhesive layer can be applied to various semiconductor chip designs and optoelectronic devices.
- Cost-effective: The use of a transparent substrate and adhesive layer in semiconductor packaging can be a cost-effective solution compared to alternative methods.
Original Abstract Submitted
A semiconductor package includes: a package substrate; a semiconductor chip disposed on the package substrate; a transparent substrate disposed on the semiconductor chip; and an adhesive layer that is disposed between the semiconductor chip and the transparent substrate. The adhesive layer is configured to block light. The transparent substrate includes: a first lower side that faces the semiconductor chip, a second lower side that faces the semiconductor chip and that is disposed above the first lower side, and a first inner side wall that connects the first lower side and the second lower side, and the adhesive layer is in contact with the second lower side and the first inner side wall.
