18190144. SEMICONDUCTOR CHIP AND SEQUENCE CHECKING CIRCUIT simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
Contents
- 1 SEMICONDUCTOR CHIP AND SEQUENCE CHECKING CIRCUIT
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR CHIP AND SEQUENCE CHECKING CIRCUIT - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR CHIP AND SEQUENCE CHECKING CIRCUIT
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Hung-Yi Chang of HSINCHU CITY (TW)
Bi-Yang Li of HSINCHU CITY (TW)
Shih-Cheng Kao of HSINCHU CITY (TW)
SEMICONDUCTOR CHIP AND SEQUENCE CHECKING CIRCUIT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18190144 titled 'SEMICONDUCTOR CHIP AND SEQUENCE CHECKING CIRCUIT
Simplified Explanation
The semiconductor chip described in the abstract includes a physical layer with an input/output circuit, sequence checking circuits, and signal transmission paths, along with a processing circuit. The sequence checking circuits generate test result signals based on clock signals and test data signals, while the processing circuit determines the operation status of the signal transmission paths based on the voltage level of the test result signals.
- The physical layer of the semiconductor chip includes an input/output circuit, sequence checking circuits, and signal transmission paths.
- The sequence checking circuits generate test result signals based on clock signals and test data signals.
- The processing circuit determines the operation status of the signal transmission paths based on the voltage level of the test result signals.
Potential Applications
This technology can be applied in various industries such as telecommunications, automotive, and consumer electronics for improving signal transmission reliability and performance.
Problems Solved
This technology helps in identifying and resolving issues related to signal transmission paths, ensuring efficient communication within the semiconductor chip.
Benefits
- Enhanced signal transmission reliability - Improved performance of the semiconductor chip - Efficient identification and resolution of signal transmission issues
Potential Commercial Applications
Optimizing Signal Transmission Paths in Semiconductor Chips for Improved Performance
Possible Prior Art
Prior art related to signal transmission testing and processing circuits in semiconductor chips may exist, but specific examples are not provided in this context.
Unanswered Questions
How does this technology impact the overall efficiency of semiconductor chips?
This technology can significantly improve the efficiency of semiconductor chips by ensuring reliable signal transmission paths, but the exact extent of this impact is not detailed in the abstract.
What are the potential limitations or challenges associated with implementing this technology in semiconductor chips?
While the abstract highlights the benefits of this technology, it does not address any potential limitations or challenges that may arise during the implementation process.
Original Abstract Submitted
A semiconductor chip includes a physical layer and a processing circuit. The physical layer includes an input/output circuit, at least one sequence checking circuit and at least one signal transmission path, wherein the at least one sequence checking circuit is configured to generate at least one test result signal according to a clock signal transmitted through the input/output circuit and at least one test data signal transmitted through the at least one signal transmission path. The processing circuit is electrically coupled to the physical layer and is configured to determine an operation status of the at least one signal transmission path according to a voltage level of the at least one test result signal.
