18186679. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE simplified abstract (SK hynix Inc.)
Contents
- 1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Jae Ho Kim of Icheon-si Gyeonggi-do (KR)
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18186679 titled 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE
Simplified Explanation
The semiconductor device described in the abstract includes a source structure with a cell area and an edge area, a stack on the edge area, a gate structure on the cell area, a channel structure connected to the cell area through the gate structure, and a read-only memory area.
- Source structure with cell and edge areas
- Stack located on the edge area of the source structure
- Gate structure located on the cell area of the source structure
- Channel structure connected to the cell area through the gate structure
- Read-only memory area
Potential Applications
The technology described in this patent application could be applied in the following areas:
- Memory devices
- Semiconductor manufacturing
- Integrated circuits
Problems Solved
This technology helps address the following issues:
- Enhancing memory storage capacity
- Improving semiconductor device performance
- Increasing data processing speed
Benefits
The benefits of this technology include:
- Higher efficiency in data storage
- Enhanced overall device performance
- Improved reliability and durability
Potential Commercial Applications
The potential commercial applications of this technology could include:
- Memory chip manufacturing
- Consumer electronics
- Telecommunications industry
Possible Prior Art
One possible prior art for this technology could be the development of similar semiconductor devices with different configurations in the past.
Unanswered Questions
How does this technology compare to existing memory devices in terms of speed and capacity?
This article does not provide a direct comparison with existing memory devices in terms of speed and capacity. Further research or testing may be needed to determine the exact performance differences.
What specific materials are used in the construction of the source structure and gate structure in this semiconductor device?
The article does not specify the exact materials used in the construction of the source structure and gate structure. Additional information on the materials could provide insights into the durability and performance of the device.
Original Abstract Submitted
A semiconductor device includes: a source structure comprising a cell area and an edge area; a stack located on the edge area of the source structure; a gate structure located on the cell area of the source structure; a channel structure connected to the cell area of the source structure by extending through the gate structure; and a read-only memory area.
