18186274. STACK PACKAGE INCLUDING INSERT DIE FOR REINFORCEMENT simplified abstract (SK hynix Inc.)
Contents
- 1 STACK PACKAGE INCLUDING INSERT DIE FOR REINFORCEMENT
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 STACK PACKAGE INCLUDING INSERT DIE FOR REINFORCEMENT - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
STACK PACKAGE INCLUDING INSERT DIE FOR REINFORCEMENT
Organization Name
Inventor(s)
Jin Woong Kim of Icheon-si Gyeonggi-do (KR)
Jong Yeon Kim of Icheon-si Gyeonggi-do (KR)
STACK PACKAGE INCLUDING INSERT DIE FOR REINFORCEMENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18186274 titled 'STACK PACKAGE INCLUDING INSERT DIE FOR REINFORCEMENT
Simplified Explanation
The abstract describes a patent application for a stack package consisting of a first die stack with first dies, a second die stack with second dies, and an insert die placed between the two stacks, which is thicker than the first and second dies.
- The innovation involves a stack package design with an insert die that is thicker than the surrounding dies.
- This configuration allows for improved performance and durability of the stack package.
- The insert die serves as a buffer between the first and second die stacks, providing structural support and stability.
Potential Applications
The technology could be applied in semiconductor manufacturing, electronic devices, and integrated circuits.
Problems Solved
The innovation addresses issues related to structural integrity, performance optimization, and durability in stack packages.
Benefits
The stack package design offers enhanced reliability, improved performance, and increased longevity compared to traditional stack configurations.
Potential Commercial Applications
The technology could be utilized in the production of advanced electronic devices, high-performance computing systems, and cutting-edge semiconductor products.
Possible Prior Art
There may be prior art related to stack package designs with insert dies, but further research is needed to identify specific examples.
Unanswered Questions
How does the thickness of the insert die impact the overall performance of the stack package?
The abstract does not provide details on the specific effects of the insert die's thickness on the stack package's functionality and efficiency.
Are there any specific manufacturing processes or materials required for implementing this stack package design?
The abstract does not mention the manufacturing methods or materials needed to create the stack package with the insert die.
Original Abstract Submitted
A stack package includes a first die stack including first dies, a second die stack including second dies, and an insert die between the first die stack and the second die stack, wherein the insert die is thicker than each of the first and second dies.
