18184559. SUBSTRATE HAVING A DIE POSITION MARK AND A SEMICONDUCTOR DIE STACK STRUCTURE INCLUDING SEMICONDUCTOR DIES STACKED ON THE SUBSTRATE simplified abstract (SK hynix Inc.)
Contents
- 1 SUBSTRATE HAVING A DIE POSITION MARK AND A SEMICONDUCTOR DIE STACK STRUCTURE INCLUDING SEMICONDUCTOR DIES STACKED ON THE SUBSTRATE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE HAVING A DIE POSITION MARK AND A SEMICONDUCTOR DIE STACK STRUCTURE INCLUDING SEMICONDUCTOR DIES STACKED ON THE SUBSTRATE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SUBSTRATE HAVING A DIE POSITION MARK AND A SEMICONDUCTOR DIE STACK STRUCTURE INCLUDING SEMICONDUCTOR DIES STACKED ON THE SUBSTRATE
Organization Name
Inventor(s)
Bok Gyu Min of Icheon-si Gyeonggi-do (KR)
Beom Sang Cho of Icheon-si Gyeonggi-do (KR)
SUBSTRATE HAVING A DIE POSITION MARK AND A SEMICONDUCTOR DIE STACK STRUCTURE INCLUDING SEMICONDUCTOR DIES STACKED ON THE SUBSTRATE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18184559 titled 'SUBSTRATE HAVING A DIE POSITION MARK AND A SEMICONDUCTOR DIE STACK STRUCTURE INCLUDING SEMICONDUCTOR DIES STACKED ON THE SUBSTRATE
Simplified Explanation
The abstract describes a substrate with specific alignment and position marks for die stacking.
- The substrate includes a first die alignment mark with a cross shape, consisting of a vertical bar and a horizontal bar intersecting perpendicularly.
- The substrate also includes a first die position mark with a main position mark and a branch position mark, each with different areas.
Potential Applications
The technology described in the patent application could be used in semiconductor manufacturing for precise alignment and positioning of dies in a stack.
Problems Solved
This technology solves the problem of accurately aligning and positioning multiple dies in a stack during the manufacturing process.
Benefits
The benefits of this technology include improved efficiency in die stacking processes, leading to higher yields and better overall performance of semiconductor devices.
Potential Commercial Applications
A potential commercial application of this technology could be in the production of advanced microprocessors and memory chips for various electronic devices.
Possible Prior Art
One possible prior art could be the use of similar alignment and position marks in the semiconductor industry for die stacking processes.
Unanswered Questions
How does this technology compare to existing die alignment methods in terms of accuracy and efficiency?
This article does not provide a direct comparison to existing die alignment methods, leaving the reader to wonder about the advantages of this new technology over current practices.
What impact could this technology have on the cost of semiconductor manufacturing?
The article does not address the potential cost implications of implementing this technology in semiconductor manufacturing processes, leaving a gap in understanding the overall economic impact.
Original Abstract Submitted
A substrate includes: a first die alignment mark and a first die position mark defining a die stack region. The first die alignment mark has substantially a cross shape having substantially a vertical bar and substantially a horizontal bar intersecting each other substantially perpendicularly, and the first die position mark includes a first main position mark having a first area and a first branch position mark having a second area different from the first area.
