18181929. SIGNAL TRANSMISSION DEVICE simplified abstract (KABUSHIKI KAISHA TOSHIBA)

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SIGNAL TRANSMISSION DEVICE

Organization Name

KABUSHIKI KAISHA TOSHIBA

Inventor(s)

Bowen Dang of Kawasaki Kanagawa (JP)

Takeshi Murasaki of Yokohama Kanagawa (JP)

Takaya Kitahara of Yokohama Kanagawa (JP)

Makoto Arai of Tachikawa Tokyo (JP)

Shoji Ootaka of Yokohama Kanagawa (JP)

SIGNAL TRANSMISSION DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18181929 titled 'SIGNAL TRANSMISSION DEVICE

Simplified Explanation

The signal transmission device described in the abstract consists of a first integrated circuit chip with a first coil, a printed circuit board with a second coil, a second integrated circuit chip with connection terminals, and wires connecting the coils to the connection terminals.

  • The first integrated circuit chip includes a first coil that acts as an isolation transformer.
  • The printed circuit board has a second coil that is magnetically coupled with the first coil to form the insulating transformer.
  • The second integrated circuit chip has connection terminals on its upper surface.
  • A first wire connects one end of the second coil to the first connection terminal.
  • A second wire connects the other end of the second coil to the second connection terminal.

Potential Applications

This technology could be used in various communication devices, such as wireless chargers, data transfer systems, and IoT devices.

Problems Solved

This innovation helps in improving signal transmission efficiency, reducing interference, and enhancing overall performance of electronic devices.

Benefits

The device offers a compact design, efficient signal transmission, and improved reliability in communication systems.

Potential Commercial Applications

Potential commercial applications include consumer electronics, telecommunications equipment, and industrial automation systems.

Possible Prior Art

One possible prior art could be the use of traditional isolation transformers in signal transmission devices.

Unanswered Questions

How does this technology compare to existing signal transmission devices in terms of efficiency and performance?

The article does not provide a direct comparison with existing technologies to evaluate the advantages of this innovation.

What are the manufacturing costs associated with implementing this technology in mass production?

The article does not address the potential manufacturing costs or scalability of this technology for mass production.


Original Abstract Submitted

A signal transmission device according to the embodiment includes: a first integrated circuit chip provided with a first coil that constitutes the isolation transformer; a printed circuit board provided with a second coil that is magnetically coupled with the first coil to form the insulating transformer; a second integrated circuit chip having a first connection terminal and a second connection terminal provided on the upper surface; a first wire that electrically connects between one end of the second coil and the first connection terminal; and a second wire that electrically connects between the other end of the second coil and the second connection terminal, wherein the second coil is provided only in the wiring layer of the printed circuit board, which has a single wiring layer structure.