18176747. TUBULAR BODY FOR FIXING MEMBER, FIXING DEVICE, AND IMAGE FORMING APPARATUS simplified abstract (FUJIFILM Business Innovation Corp.)

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TUBULAR BODY FOR FIXING MEMBER, FIXING DEVICE, AND IMAGE FORMING APPARATUS

Organization Name

FUJIFILM Business Innovation Corp.

Inventor(s)

Ryosuke Kubota of Kanagawa (JP)

TUBULAR BODY FOR FIXING MEMBER, FIXING DEVICE, AND IMAGE FORMING APPARATUS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18176747 titled 'TUBULAR BODY FOR FIXING MEMBER, FIXING DEVICE, AND IMAGE FORMING APPARATUS

Simplified Explanation

The tubular body for a fixing member described in the patent application consists of a first layer with high thermal conductivity and a second layer containing resin and solid material particles that undergo heat absorption/release during electronic phase transition.

  • The first layer of the tubular body has a thermal conductivity of 1.0 W/m·K or higher.
  • The second layer of the tubular body contains a resin and solid material particles that exhibit heat absorption/release related to electronic phase transition.

Potential Applications

The technology described in this patent application could be applied in various industries such as electronics, automotive, aerospace, and construction for heat dissipation and thermal management purposes.

Problems Solved

This innovation addresses the issue of efficiently managing heat dissipation in fixing members, which is crucial for the performance and longevity of electronic devices and other equipment.

Benefits

- Improved thermal conductivity - Enhanced heat dissipation capabilities - Increased efficiency in electronic devices

Potential Commercial Applications

"Thermal Management Solutions for Fixing Members: Enhancing Performance and Longevity"

Possible Prior Art

There may be prior art related to thermal management solutions for fixing members in various industries, but specific examples are not provided in this patent application.

Unanswered Questions

How does this technology compare to existing thermal management solutions in terms of cost-effectiveness and performance?

This article does not provide a direct comparison with existing thermal management solutions in terms of cost-effectiveness and performance. Further research or testing may be needed to evaluate the technology's competitiveness in the market.

What are the specific electronic devices or equipment that could benefit the most from this innovation?

The patent application does not specify the specific electronic devices or equipment that could benefit the most from this innovation. Identifying the target market and potential applications in detail could provide valuable insights for commercialization efforts.


Original Abstract Submitted

A tubular body for a fixing member includes: a first layer having a thermal conductivity of 1.0 W/m·K or more; and a second layer containing a resin and particles of a solid material in which heat absorption/release associated with electronic phase transition occurs.