18175947. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
YECHUNG Chung of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18175947 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The abstract of this patent application describes a semiconductor package that consists of a flexible base film, a semiconductor chip attached to one side of the base film, and a heat radiating member on the other side of the base film. The base film has a recess pattern on its second surface, which is located near the semiconductor chip. The heat radiating member is positioned within the recess pattern.
- The semiconductor package includes a flexible base film.
- A semiconductor chip is mounted on one side of the base film.
- A heat radiating member is attached to the other side of the base film.
- The base film has a recess pattern on its second surface.
- The recess pattern is located adjacent to the semiconductor chip.
- The heat radiating member is positioned within the recess pattern.
Potential applications of this technology:
- Electronics industry: This semiconductor package can be used in various electronic devices, such as smartphones, tablets, and computers, to efficiently dissipate heat generated by the semiconductor chip.
- Automotive industry: The semiconductor package can be utilized in automotive electronics, such as engine control units and infotainment systems, to enhance thermal management and improve overall performance.
Problems solved by this technology:
- Heat dissipation: The recess pattern and heat radiating member help to dissipate heat generated by the semiconductor chip, preventing overheating and potential damage to the chip.
- Flexibility: The use of a flexible base film allows for easier integration of the semiconductor package into different electronic devices, providing more design flexibility.
Benefits of this technology:
- Improved thermal management: The heat radiating member and recess pattern enhance the heat dissipation capabilities of the semiconductor package, ensuring the semiconductor chip operates at optimal temperatures.
- Compact design: The use of a flexible base film and the integration of the heat radiating member within the recess pattern allow for a more compact and space-efficient semiconductor package.
- Versatility: The semiconductor package can be easily integrated into various electronic devices due to its flexible nature, making it a versatile solution for different applications.
Original Abstract Submitted
A semiconductor package includes a flexible base film, a semiconductor chip on a first surface of the base film, and a heat radiating member on a second surface of the base film. The base film has a recess pattern in the second surface. The recess pattern is adjacent the semiconductor chip. The heat radiating member may be in the recess pattern.
