18174992. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
CHOONGBIN Yim of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18174992 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Simplified Explanation
The abstract describes a semiconductor package that includes a package substrate, substrate pads, core balls, a redistribution substrate, and a semiconductor chip. The core balls are larger in diameter than the solder balls used for electrical connections.
- The semiconductor package includes a package substrate.
- Substrate pads are provided on the top surface of the package substrate.
- At least one core ball is placed on one of the substrate pads.
- A redistribution substrate is placed on top of the package substrate.
- A semiconductor chip is mounted on the redistribution substrate.
- The redistribution substrate is electrically connected to the package substrate through solder balls on its bottom surface.
- The core ball is electrically connected to the redistribution substrate.
- The diameter of the core ball is larger than the diameter of the solder balls.
Potential Applications
- This technology can be used in various semiconductor devices and electronic systems.
- It can be applied in the manufacturing of integrated circuits and microprocessors.
Problems Solved
- The use of larger core balls provides improved electrical connections and reliability.
- It helps to enhance the performance and functionality of semiconductor packages.
Benefits
- The larger core balls offer better electrical conductivity and stability.
- The technology improves the overall performance and reliability of semiconductor packages.
- It allows for more efficient and effective integration of semiconductor chips.
Original Abstract Submitted
A semiconductor package includes a package substrate, substrate pads provided on a top surface of the package substrate, at least one core ball on at least one of the substrate pads, a redistribution substrate provided on the top surface of the package substrate, and a semiconductor chip mounted on the redistribution substrate. The redistribution substrate is electrically connected to the package substrate through a plurality of solder balls provided on a bottom surface of the redistribution substrate. The at least one core ball is electrically connected to the redistribution substrate. A diameter of the at least one core ball is greater than a diameter of each of the plurality of solder balls.
