18169516. POWER AMPLIFIER CHIP AND COMMUNICATION DEVICE simplified abstract (Huawei Technologies Co., Ltd.)
Contents
POWER AMPLIFIER CHIP AND COMMUNICATION DEVICE
Organization Name
Inventor(s)
Shengchang Shangguan of Shanghai (CN)
POWER AMPLIFIER CHIP AND COMMUNICATION DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18169516 titled 'POWER AMPLIFIER CHIP AND COMMUNICATION DEVICE
Simplified Explanation
The abstract describes a patent application for power amplifier chips and communication devices. One example power amplifier chip consists of a package housing and multiple power amplifier dies. These dies are packaged within the housing, and each die contains at least one stage of power amplifier.
- The patent application is for power amplifier chips and communication devices.
- One example power amplifier chip includes a package housing and multiple power amplifier dies.
- The power amplifier dies are packaged within the housing.
- Each power amplifier die contains at least one stage of power amplifier.
Potential Applications
This technology can be applied in various fields, including:
- Wireless communication devices
- Mobile phones
- Satellite communication systems
- Radio frequency transmitters
Problems Solved
The patent application addresses the following problems:
- Efficient power amplification in communication devices
- Packaging multiple power amplifier dies in a compact manner
- Ensuring each power amplifier die includes at least one stage of power amplifier
Benefits
The technology offers several benefits, such as:
- Improved power amplification performance
- Compact packaging of power amplifier dies
- Enhanced efficiency in communication devices
- Increased reliability and functionality in power amplification systems
Original Abstract Submitted
Example power amplifier chips and communication devices are described. One example power amplifier chip includes a package housing and a plurality of power amplifier dies. The plurality of power amplifier dies are packaged in the package housing, and each of the plurality of power amplifier dies includes at least one stage of power amplifier.
