18166869. METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGES simplified abstract (Samsung Electronics Co., Ltd.)

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METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGES

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Myungsam Kang of Hwaseong-si (KR)

Youngchan Ko of Seoul (KR)

Jeongseok Kim of Cheonan-si (KR)

Kyungdon Mun of Hwaseong-si (KR)

METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGES - A simplified explanation of the abstract

This abstract first appeared for US patent application 18166869 titled 'METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGES

Simplified Explanation

The abstract describes a semiconductor package that includes a redistribution structure and an under-bump metal (UBM) structure. The redistribution structure consists of an insulating layer and a redistribution layer on top of it. The UBM structure includes a UBM pad protruding from the redistribution structure's first surface and a UBM via that connects the redistribution layer and the UBM pad by penetrating through the insulating layer. The UBM via has a lower surface with two areas - a first area in contact with the UBM pad and a second area that extends outwardly of the first area and has a step configuration.

  • The semiconductor package includes a redistribution structure with an insulating layer and a redistribution layer.
  • It also includes an under-bump metal (UBM) structure with a UBM pad and a UBM via.
  • The UBM pad protrudes from the first surface of the redistribution structure.
  • The UBM via connects the redistribution layer and the UBM pad by penetrating through the insulating layer.
  • The lower surface of the UBM via has a first area in contact with the UBM pad.
  • The lower surface also has a second area with a step configuration that extends outwardly of the first area.

Potential Applications

  • Semiconductor packaging industry
  • Electronics manufacturing

Problems Solved

  • Provides a structure for connecting the redistribution layer and the UBM pad in a semiconductor package.
  • Allows for efficient electrical connections in a compact design.

Benefits

  • Improved electrical connectivity in semiconductor packages.
  • Enables smaller and more efficient electronic devices.


Original Abstract Submitted

A semiconductor package includes a redistribution structure including an insulating layer and a redistribution layer on the insulating layer, and having a first surface and a second surface opposing the first surface, and an under-bump metal (UBM) structure including an UBM pad protruding from the first surface of the redistribution structure, and an UBM via penetrating through the insulating layer and connecting the redistribution layer and the UBM pad. A lower surface of the UBM via has a first area in contact with the UBM pad, and a second area having a step configuration relative to the first area and that extends outwardly of the first area.

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