18164184. ANTENNA MODULE AND ELECTRONIC DEVICE INCLUDING SAME simplified abstract (Samsung Electronics Co., Ltd.)
ANTENNA MODULE AND ELECTRONIC DEVICE INCLUDING SAME
Organization Name
Inventor(s)
Kwanghyun Baek of Suwon-si (KR)
Chunmyung Park of Suwon-si (KR)
ANTENNA MODULE AND ELECTRONIC DEVICE INCLUDING SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18164184 titled 'ANTENNA MODULE AND ELECTRONIC DEVICE INCLUDING SAME
Simplified Explanation
The patent application describes an electronic device that includes multiple antenna arrays and multiple printed circuit boards (PCBs). The device also includes a power interface and a grid array that connects the first surface of each PCB corresponding to an antenna array with the first surface of the second PCB. A feeding line is formed on at least one of the layers of the PCBs or the second PCB to transfer signals to the antenna elements.
- The electronic device has multiple antenna arrays and corresponding PCB sets.
- A second PCB with a power interface is included in the device.
- A grid array connects the first surface of each PCB with the first surface of the second PCB.
- A feeding line is formed on one of the layers of the PCBs or the second PCB to transfer signals to the antenna elements.
Potential Applications
- Wireless communication devices
- Internet of Things (IoT) devices
- Mobile devices
- Smart home systems
Problems Solved
- Simplifies the design and assembly of electronic devices with multiple antenna arrays
- Enables efficient signal transfer to the antenna elements
- Reduces the size of the PCBs while maintaining functionality
Benefits
- Improved performance and reliability of wireless communication
- Compact and space-saving design
- Cost-effective production and assembly of electronic devices
Original Abstract Submitted
An electronic device is provided. The electronic device includes multiple antenna arrays, multiple first printed circuit board (PCB) sets corresponding to the multiple antenna arrays, a second PCB including a power interface, and a grid array configured to couple a first surface of each of first PCBs of the first PCB sets corresponding to an antenna array and a first surface of the second PCB, wherein the size of the first PCB is smaller than that of the second PCB, and a feeding line configured to transfer a signal to an antenna element is formed on at least one of a layer corresponding to the first surface of each of the first PCBs or a layer corresponding to the first surface of the second PCB.
