18163410. ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Yu-Lun Lu of Hsinchu City (TW)
Kong-Beng Thei of Pao-Shan Villlage (TW)
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18163410 titled 'ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
Simplified Explanation
The electronic device described in the patent application includes upper and lower electronic structures connected by metal layers and connection structures. The upper and lower connection structures are bonded together.
- Upper and lower electronic structures
- Metal layers connecting the electronic structures to connection structures
- Bonded upper and lower connection structures
Potential Applications
- Consumer electronics
- Medical devices
- Automotive technology
Problems Solved
- Improved electrical connectivity
- Enhanced device performance
- Simplified manufacturing process
Benefits
- Increased reliability
- Higher efficiency
- Cost-effective production
Original Abstract Submitted
An electronic device and a method for manufacturing the same are provided. The electronic device includes an upper electronic structure, an upper connection structure, a first metal layer, a lower electronic structure, a lower connection structure and a second metal layer. The first metal layer electrically connects the upper electronic structure to the upper connection structure. The second metal layer electrically connects the lower electronic structure to the lower connection structure. The upper connection structure and the lower connection structure are bonded together.
