18161778. SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREOF

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Szu-Hsien Lee of Tainan City (TW)

Yun-Chung Wu of Taipei City (TW)

Pei-Wei Lee of Oingtung County (TW)

Fu Wei Liu of Tainan (TW)

Jhao-Yi Wang of Tainan (TW)

SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 18161778 titled 'SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREOF

Simplified Explanation

The semiconductor chip described in the abstract includes an array of pillar structures, with ground pillars and working pillars, as well as dummy pillar structures surrounding them. Active devices inside the chip are connected to the working pillars, while the ground pillars and dummy pillars form a current pathway on the front surface of the chip.

• Pillar structures with ground pillars and working pillars
• Dummy pillar structures surrounding the pillar structures
• Active devices connected to working pillars
• Ground pillars and dummy pillars forming a current pathway

Potential Applications

The technology described in this patent application could be applied in the following areas:

• Semiconductor manufacturing
• Integrated circuits
• Electronics industry

Problems Solved

This technology helps address the following issues:

• Efficient current pathways on semiconductor chips
• Improved electrical connections within the chip
• Enhanced performance of active devices

Benefits

The benefits of this technology include:

• Enhanced electrical connectivity
• Increased efficiency in semiconductor chip design
• Improved overall performance of the chip

Potential Commercial Applications

With its focus on improving current pathways and electrical connections within semiconductor chips, this technology could find commercial applications in:

• Consumer electronics
• Telecommunications
• Automotive industry

Possible Prior Art

One possible prior art that may be related to this technology is the use of dummy structures in semiconductor manufacturing to improve electrical connectivity and performance.

How does this technology compare to existing solutions in terms of efficiency and performance?

This article does not provide a direct comparison with existing solutions in terms of efficiency and performance. It would be helpful to have data or analysis on how this technology improves upon current practices.

What are the potential challenges or limitations of implementing this technology in practical applications?

The article does not address potential challenges or limitations of implementing this technology in practical applications. It would be important to consider factors such as cost, scalability, and compatibility with existing manufacturing processes.

Original Abstract Submitted

A semiconductor chip and a manufacturing method thereof are provided. The semiconductor chip includes: an array of pillar structures, disposed on a front surface of the semiconductor chip, and respectively including a ground pillar and multiple working pillars laterally spaced apart from and substantially parallel with a line portion of the ground pillar; and dummy pillar structures, disposed on the front surface of the semiconductor chip and laterally surrounding the pillar structures. Active devices formed inside the semiconductor chip are electrically connected to the working pillar. The ground pillars of the pillar structures and the dummy pillar structures are electrically connected to form a current pathway on the front surface of the semiconductor chip.