18160055. POWER CONVERSION DEVICE simplified abstract (Mitsubishi Electric Corporation)
Contents
POWER CONVERSION DEVICE
Organization Name
Mitsubishi Electric Corporation
Inventor(s)
Takuya Kuramochi of Tokyo (JP)
POWER CONVERSION DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18160055 titled 'POWER CONVERSION DEVICE
Simplified Explanation
The patent application describes a power conversion device that includes a fuse and semiconductor elements connected to an input power supply. The semiconductor elements have a semiconductor chip with an electrode on its upper face, and plate-form wiring members made of a plate-form conductor through which current flows. The semiconductor chip and wiring members are sealed using a sealing resin, and the fuse has a shorter fusion time than the wiring members.
- The power conversion device includes a fuse and semiconductor elements connected to an input power supply.
- The semiconductor elements have a semiconductor chip with an electrode on its upper face.
- Plate-form wiring members made of a plate-form conductor are mounted on the electrode.
- The plate-form wiring members allow current passing through the fuse to flow.
- The semiconductor chip and plate-form wiring members are sealed using a sealing resin.
- The fuse has a shorter fusion time than the plate-form wiring members.
Potential Applications
- Power conversion devices in various industries such as electronics, automotive, and renewable energy.
- Energy storage systems.
- Power distribution systems.
Problems Solved
- Ensures efficient power conversion by protecting the semiconductor elements from excessive current.
- Prevents damage to the power conversion device by quickly disconnecting the input power supply in case of a fault.
- Improves the reliability and safety of power conversion devices.
Benefits
- Enhanced protection for semiconductor elements and improved overall device reliability.
- Faster response time in case of a fault, reducing the risk of damage.
- Increased safety for users and equipment.
- Potential for cost savings in terms of maintenance and replacement of damaged components.
Original Abstract Submitted
A power conversion device includes a fuse connected to an input power supply, and semiconductor elements connected in series to the input power supply via the fuse, wherein the semiconductor elements have a semiconductor chip, which has an electrode on an upper face thereof, and plate-form wiring members, which are mounted on the electrode and are formed of a plate-form conductor through which current passing through the fuse flows, and are configured by the semiconductor chip and the plate-form wiring members being sealed using a sealing resin, and a fusion time of the fuse is shorter than a fusion time of the plate-form wiring members.
