18159132. METHOD OF MANUFACTURING PACKAGE UNIT, PACKAGE UNIT, ELECTRONIC MODULE, AND EQUIPMENT simplified abstract (CANON KABUSHIKI KAISHA)
METHOD OF MANUFACTURING PACKAGE UNIT, PACKAGE UNIT, ELECTRONIC MODULE, AND EQUIPMENT
Organization Name
Inventor(s)
Koichi Shimizu of Fujisawa-shi (JP)
Satoru Hamasaki of Fujisawa-shi (JP)
METHOD OF MANUFACTURING PACKAGE UNIT, PACKAGE UNIT, ELECTRONIC MODULE, AND EQUIPMENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18159132 titled 'METHOD OF MANUFACTURING PACKAGE UNIT, PACKAGE UNIT, ELECTRONIC MODULE, AND EQUIPMENT
Simplified Explanation
The patent application describes a method of manufacturing a package unit using a circuit board and a mold. The circuit board has three regions - a first region, a second region, and a third region. The mold has a frame-shaped protruding portion that divides it into a first cavity and a second cavity.
- The circuit board is prepared with the first region facing the first cavity and the second region facing the second cavity.
- A gap is formed between the frame-shaped protruding portion of the mold and the third region of the circuit board.
- A frame-shaped resin member is formed on top of the second region of the circuit board by pouring resin into the second cavity.
Potential applications of this technology:
- Electronics manufacturing industry
- Packaging industry
Problems solved by this technology:
- Simplifies the manufacturing process of package units
- Provides a method for securely attaching a resin member to a circuit board
Benefits of this technology:
- Streamlines production and reduces manufacturing time
- Enhances the durability and stability of the package unit
- Provides a cost-effective solution for package unit manufacturing
Original Abstract Submitted
A method of manufacturing a package unit, comprising: preparing a circuit board having a first region, a second region surrounding the first region, and a third region between the first and the second region; preparing a mold having a frame-shaped protruding portion surrounding a first cavity, the frame-shaped protruding portion partitioning the first cavity and a second cavity surrounding the first cavity; arranging the circuit board and the mold such that the first region of the circuit board faces the first cavity, the second region of the circuit board faces the second cavity, and a gap which communicates the first cavity and the second cavity with each other is formed between the frame-shaped protruding portion and the third region of the circuit board; and forming a frame-shaped resin member on top of the second region of the circuit board by pouring a resin into the second cavity.
