18158276. CLEANING LIQUID NOZZLE, CLEANING APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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CLEANING LIQUID NOZZLE, CLEANING APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Ho-Young Kim of Seoul (KR)

Chae Lyung Kim of Hwaseong-si (KR)

Tae-Hong Kim of Seoul (KR)

Yungjun Kim of Seoul (KR)

Boun Yoon of Seoul (KR)

Sol Han of Seoul (KR)

Joonoh Kim of Geumjeong-gu (KR)

CLEANING LIQUID NOZZLE, CLEANING APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18158276 titled 'CLEANING LIQUID NOZZLE, CLEANING APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME

Simplified Explanation

The abstract describes a cleaning apparatus that includes a nozzle connected to gas and cleaning liquid supply lines. The nozzle applies the cleaning liquid to a substrate and has a gas entrance port, a cleaning liquid entrance port, and a fluid injection port. The internal passage of the nozzle connects these ports, and the fluid injection port has a larger diameter than the cleaning liquid entrance port.

  • The cleaning apparatus includes a nozzle that applies cleaning liquid to a substrate.
  • The nozzle is connected to gas and cleaning liquid supply lines.
  • The gas entrance port at the top of the nozzle is connected to the gas supply line.
  • The first cleaning liquid entrance port on the sidewall of the nozzle is connected to the cleaning liquid supply line.
  • The fluid injection port at the bottom of the nozzle discharges both the gas and the cleaning liquid.
  • The internal passage of the nozzle connects the gas entrance port, the first cleaning liquid entrance port, and the fluid injection port.
  • The fluid injection port has a larger diameter than the first cleaning liquid entrance port.

Potential Applications

  • Industrial cleaning processes
  • Semiconductor manufacturing
  • Printed circuit board cleaning
  • Precision cleaning in medical equipment

Problems Solved

  • Efficient and effective application of cleaning liquid to a substrate
  • Simultaneous use of gas and cleaning liquid for cleaning purposes
  • Control and direction of cleaning liquid flow

Benefits

  • Improved cleaning performance
  • Reduced cleaning time
  • Enhanced precision and control in cleaning processes
  • Versatile and adaptable for various cleaning applications


Original Abstract Submitted

A cleaning apparatus includes a gas supply line and a cleaning liquid supply line. A nozzle is connected to the gas and the cleaning liquid supply lines. The nozzle applies the cleaning liquid to a substrate. A gas entrance port at a top of a body of the nozzle is connected to the gas supply line. A first cleaning liquid entrance port is disposed on a sidewall of the nozzle body and is connected to the cleaning liquid supply line. A fluid injection port is disposed at a bottom of the nozzle body and discharges both the gas and the cleaning liquid. An internal passage of the nozzle body connects each of the gas entrance port and the first cleaning liquid entrance port to the fluid injection port. The fluid injection port has a diameter that is greater than a diameter of the first cleaning liquid entrance port.