18157916. SEMICONDUCTOR APPARATUS AND EQUIPMENT simplified abstract (CANON KABUSHIKI KAISHA)
Contents
SEMICONDUCTOR APPARATUS AND EQUIPMENT
Organization Name
Inventor(s)
SEMICONDUCTOR APPARATUS AND EQUIPMENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18157916 titled 'SEMICONDUCTOR APPARATUS AND EQUIPMENT
Simplified Explanation
The patent application describes a semiconductor apparatus that includes multiple substrates and a conductive layer with an electrode. It also includes a through via that passes through the second substrate and part of the insulating member to reach the electrode. An opening is arranged in the first substrate and part of the insulating member, overlapping the electrode. Two resin layers are placed between the electrode and the third substrate, with the first resin layer within the opening and having a different Young's modulus from the second resin layer.
- The semiconductor apparatus includes multiple substrates and a conductive layer with an electrode.
- A through via is present, passing through the second substrate and part of the insulating member to reach the electrode.
- An opening is arranged in the first substrate and part of the insulating member, overlapping the electrode.
- Two resin layers are placed between the electrode and the third substrate.
- The first resin layer is within the opening and has a different Young's modulus from the second resin layer.
Potential Applications
- Semiconductor manufacturing
- Electronics industry
- Integrated circuit design
Problems Solved
- Improved connectivity between substrates in a semiconductor apparatus
- Enhanced insulation and protection of the conductive layer and electrode
- Increased flexibility and adaptability in semiconductor design
Benefits
- Improved performance and reliability of semiconductor devices
- Enhanced durability and resistance to external factors
- Simplified manufacturing processes for semiconductor apparatus
Original Abstract Submitted
A semiconductor apparatus comprising a first substrate, a second substrate coupled with the first substrate via an insulating member, a third substrate coupled to the first substrate and disposed on the opposite side to the second substrate and a conductive layer including an electrode disposed between the first and second substrate is provided. A through via is disposed so as to pass through the second substrate and a part of the insulating member to reach the electrode. An opening is arranged overlapping the electrode in the first substrate and a part of the insulating member. First and second resin layers are disposed between the electrode and the third substrate, and the first resin layer is disposed within the opening, is disposed between the electrode and the second resin layer and has a different Young's modulus from the second resin layer.
