18156086. LAYOUTS FOR CONDUCTIVE LAYERS IN INTEGRATED CIRCUITS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
LAYOUTS FOR CONDUCTIVE LAYERS IN INTEGRATED CIRCUITS
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Chung-Hsing Wang of Hsinchu (TW)
Meng-Xiang Lee of Hsinchu (TW)
LAYOUTS FOR CONDUCTIVE LAYERS IN INTEGRATED CIRCUITS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18156086 titled 'LAYOUTS FOR CONDUCTIVE LAYERS IN INTEGRATED CIRCUITS
Simplified Explanation
The patent application describes different layouts for conductive interconnects in an integrated circuit, specifically focusing on the power delivery system. The conductive interconnects in the first conductor layer are arranged orthogonally, while the conductive interconnects in the second conductor layer are arranged non-orthogonally. The conductive stripes in a transition conductor layer connect the interconnects in the first and second conductor layers.
- Conductive interconnects in an integrated circuit are arranged in different layouts.
- The first conductor layer uses an orthogonal layout for its interconnects.
- The second conductor layer uses a non-orthogonal layout for its interconnects.
- A transition conductor layer with conductive stripes connects the interconnects between the first and second conductor layers.
Potential Applications
- Integrated circuits and semiconductor devices
- Power delivery systems in electronic devices
Problems Solved
- Efficient arrangement of conductive interconnects in integrated circuits
- Improved power delivery system design
Benefits
- Enhanced performance and functionality of integrated circuits
- More efficient power delivery in electronic devices
Original Abstract Submitted
Various layouts for conductive interconnects in the conductor layers in an integrated circuit are disclosed. Some or all of the conductive interconnects are included in a power delivery system. In general, the conductive interconnects in a first conductor layer are arranged according to an orthogonal layout and the conductive interconnects in a second conductor layer are arranged according to a non-orthogonal layout. Conductive stripes in a transition conductor layer positioned between the first and the second conductor layers electrically connect the conductive interconnects in the first conductor layer to the conductive interconnects in the second conductor layer.
