18155705. PACKAGE STRUCTURE INCLUDING IPD AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

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PACKAGE STRUCTURE INCLUDING IPD AND METHOD OF FORMING THE SAME

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Hua-Wei Tseng of New Taipei City (TW)

Yueh-Ting Lin of Taipei City (TW)

Shao-Yun Chen of Tao-yuan City (TW)

Li-Hsien Huang of Hsinchu County (TW)

An-Jhih Su of Taoyuan City (TW)

Ming-Shih Yeh of Hsinchu County (TW)

Der-Chyang Yeh of Hsin-Chu (TW)

PACKAGE STRUCTURE INCLUDING IPD AND METHOD OF FORMING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18155705 titled 'PACKAGE STRUCTURE INCLUDING IPD AND METHOD OF FORMING THE SAME

Simplified Explanation

The patent application describes a package structure and method for forming it, which includes a die, an encapsulant, a first RDL structure, an IPD, and an underfill layer. The IPD includes a substrate, a first connector, a guard structure, and a second connector. The underfill layer fills the space between the IPD and the first RDL structure, but is separated from the connector region by the guard structure.

  • The package structure includes a die, encapsulant, first RDL structure, IPD, and underfill layer.
  • The IPD includes a substrate, first connector, guard structure, and second connector.
  • The underfill layer fills the space between the IPD and the first RDL structure.
  • The guard structure separates the underfill layer from the connector region.

Potential Applications

  • Semiconductor packaging
  • Electronics manufacturing

Problems Solved

  • Ensures proper electrical connections between components
  • Provides protection and stability to the package structure

Benefits

  • Improved reliability and performance of the package structure
  • Simplified manufacturing process
  • Enhanced electrical connectivity and signal transmission


Original Abstract Submitted

A package structure including IPD and method of forming the same are provided. The package structure includes a die, an encapsulant laterally encapsulating the die, a first RDL structure disposed on the encapsulant and the die, an IPD disposed on the first RDL structure and an underfill layer. The IPD includes a substrate, a first connector on a first side of the substrate and electrically connected to the first RDL structure, a guard structure on a second side of the substrate opposite to the first side and laterally surrounding a connector region, and a second connector disposed within the connector region and electrically connected to a conductive via embedded in the substrate. The underfill layer is disposed to at least fill a space between the first side of the IPD and the first RDL structure. The underfill layer is separated from the connector region by the guard structure.

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