18154329. SEMICONDUCTOR PACKAGE FIXTURE AND METHODS OF MANUFACTURING simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Contents
- 1 SEMICONDUCTOR PACKAGE FIXTURE AND METHODS OF MANUFACTURING
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE FIXTURE AND METHODS OF MANUFACTURING - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does this technology compare to existing solutions in terms of cost-effectiveness?
- 1.11 What specific materials are used in the thermal interface material and footing structures?
- 1.12 Original Abstract Submitted
SEMICONDUCTOR PACKAGE FIXTURE AND METHODS OF MANUFACTURING
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Chih-Hao Chen of Taipei City (TW)
Li-Hui Cheng of New Taipei City (TW)
Ying-Ching Shih of Hsinchu City (TW)
SEMICONDUCTOR PACKAGE FIXTURE AND METHODS OF MANUFACTURING - A simplified explanation of the abstract
This abstract first appeared for US patent application 18154329 titled 'SEMICONDUCTOR PACKAGE FIXTURE AND METHODS OF MANUFACTURING
Simplified Explanation
The abstract describes a patent application for a fixture that includes a semiconductor die package mounted to an interposer, a lid component with footing structures connecting it to the interposer, and a thermal interface material between the die package and the lid component.
- The fixture includes a semiconductor die package mounted to an interposer.
- The fixture includes a lid component with footing structures connecting it to the interposer.
- A thermal interface material is present between the die package and the lid component.
- The footing structures increase the structural rigidity of the fixture compared to fixtures without them.
Potential Applications
This technology could be applied in the manufacturing of electronic devices, such as computers, smartphones, and other consumer electronics.
Problems Solved
This technology solves the problem of ensuring proper thermal management and structural rigidity in semiconductor die packages during manufacturing and operation.
Benefits
The benefits of this technology include improved thermal performance, increased structural stability, and potentially longer lifespan of electronic devices.
Potential Commercial Applications
This technology could be commercially applied in the semiconductor industry for the production of high-performance electronic devices.
Possible Prior Art
One possible prior art for this technology could be the use of thermal interface materials in electronic packaging to improve heat dissipation and performance.
Unanswered Questions
How does this technology compare to existing solutions in terms of cost-effectiveness?
The abstract does not provide information on the cost-effectiveness of this technology compared to existing solutions.
What specific materials are used in the thermal interface material and footing structures?
The abstract does not specify the exact materials used in the thermal interface material and footing structures.
Original Abstract Submitted
Some implementations described herein provide techniques and apparatuses for a fixture including a semiconductor die package and methods of formation. The semiconductor die package is mounted to an interposer. In addition to the semiconductor die package, the fixture includes a lid component having a top structure and footing structures that connect the lid component to the interposer. The fixture includes a thermal interface material between a top surface of the semiconductor die package and the top structure of the lid component. The footing structures, connected to the interposer using deposits of an epoxy material, provide increase a structural rigidity of the fixture relative to another fixture not including the footing structures.
