18154261. SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
Organization Name
Inventor(s)
Junggeun Shin of Suwon-si (KR)
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18154261 titled 'SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
Simplified Explanation
The abstract describes a semiconductor package that includes multiple layers of redistribution structures and semiconductor chips, as well as a vertical connection structure. The vertical connection structure connects the redistribution structures and allows for electrical connections between them.
- The semiconductor package includes a first redistribution structure with a redistribution via.
- A first package is located on the upper surface of the first redistribution structure and has a first pad.
- A second redistribution structure is located on the lower surface of the first redistribution structure and includes a second redistribution via.
- A second semiconductor chip is positioned between the first and second redistribution structures and has a connection pad.
- A vertical connection structure is present between the first and second redistribution structures.
- The vertical connection structure is electrically connected to the first and second redistribution vias.
- The connection pad is electrically connected to the second redistribution via.
- The first redistribution via is electrically connected to the first pad.
Potential Applications
- This semiconductor package can be used in various electronic devices that require compact and efficient packaging of semiconductor chips.
- It can be applied in mobile devices, computers, automotive electronics, and other consumer electronics.
Problems Solved
- The semiconductor package solves the problem of connecting multiple semiconductor chips and redistribution structures in a compact and efficient manner.
- It provides a vertical connection structure that allows for electrical connections between different layers of the package.
Benefits
- The semiconductor package offers improved electrical connectivity and signal transmission between semiconductor chips and redistribution structures.
- It enables a more compact and efficient design of electronic devices by reducing the space required for interconnections.
- The vertical connection structure enhances the overall performance and reliability of the semiconductor package.
Original Abstract Submitted
A semiconductor package, comprising: a first redistribution structure including a first redistribution via; a first package that is on an upper surface of the first redistribution structure and comprises a first pad; a second redistribution structure that is on a lower surface of the first redistribution structure and comprises a second redistribution via; a second semiconductor chip that is between the first redistribution structure and the second redistribution structure and comprises a connection pad; and a vertical connection structure that is between the first redistribution structure and the second redistribution structure, wherein the vertical connection structure is electrically connected to the first redistribution via and the second redistribution via, the connection pad is electrically connected to the second redistribution via, and the first redistribution via is electrically connected to the first pad.
