18152541. SEMICONDUCTOR APPARATUS HAVING FIRST AND SECOND BONDING MEMBERS, DISPLAY APPARATUS, PHOTOELECTRIC CONVERSION APPARATUS, ELECTRONIC DEVICE, ILLUMINATION APPARATUS, AND MOVING BODY simplified abstract (CANON KABUSHIKI KAISHA)

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SEMICONDUCTOR APPARATUS HAVING FIRST AND SECOND BONDING MEMBERS, DISPLAY APPARATUS, PHOTOELECTRIC CONVERSION APPARATUS, ELECTRONIC DEVICE, ILLUMINATION APPARATUS, AND MOVING BODY

Organization Name

CANON KABUSHIKI KAISHA

Inventor(s)

Hidemasa Oshige of Yokohama-shi (JP)

SEMICONDUCTOR APPARATUS HAVING FIRST AND SECOND BONDING MEMBERS, DISPLAY APPARATUS, PHOTOELECTRIC CONVERSION APPARATUS, ELECTRONIC DEVICE, ILLUMINATION APPARATUS, AND MOVING BODY - A simplified explanation of the abstract

This abstract first appeared for US patent application 18152541 titled 'SEMICONDUCTOR APPARATUS HAVING FIRST AND SECOND BONDING MEMBERS, DISPLAY APPARATUS, PHOTOELECTRIC CONVERSION APPARATUS, ELECTRONIC DEVICE, ILLUMINATION APPARATUS, AND MOVING BODY

Simplified Explanation

The patent application describes a semiconductor apparatus that includes an element substrate with effective pixels and a peripheral region, a second substrate, and bonding members to bond the substrates. The second bonding member is made of a different material than the first bonding member. The second substrate is positioned within the element substrate, and the first bonding member is between the peripheral region and the second substrate, while the second bonding member is between the effective pixel region and the second substrate. At least part of the end portion of the second substrate is positioned on the first bonding member.

  • The semiconductor apparatus includes an element substrate with effective pixels and a peripheral region.
  • A second substrate is positioned within the element substrate.
  • The first bonding member is between the peripheral region and the second substrate.
  • The second bonding member is between the effective pixel region and the second substrate.
  • At least part of the end portion of the second substrate is positioned on the first bonding member.

Potential Applications

  • This semiconductor apparatus can be used in various electronic devices such as smartphones, tablets, and digital cameras.
  • It can be utilized in display technologies like LCDs and OLEDs.
  • The apparatus can also find applications in medical imaging devices, automotive displays, and virtual reality headsets.

Problems Solved

  • The semiconductor apparatus provides a reliable bonding structure between the element substrate and the second substrate.
  • It ensures proper alignment and positioning of the substrates, enhancing the overall performance and durability of the device.
  • The use of different bonding materials allows for optimized bonding strength and compatibility with different substrate materials.

Benefits

  • The simplified bonding structure simplifies the manufacturing process and reduces production costs.
  • The improved bonding reliability enhances the longevity and performance of the semiconductor apparatus.
  • The optimized bonding materials provide better compatibility and bonding strength, leading to a more robust device.


Original Abstract Submitted

A semiconductor apparatus includes an element substrate including an effective pixel region having a plurality of effective pixels on one principal surface side of a first substrate, and a peripheral region positioned around the effective pixel region, a second substrate, and a first and a second bonding member configured to bond the both substrates. The second bonding member includes a material different from that of the first bonding member. In a planar view with respect to the one principal surface, the second substrate is disposed within the element substrate. The first bonding member is provided between the peripheral region and the second substrate. The second bonding member is provided between the effective pixel region and the second substrate. In a planar view with respect to the one principal surface, at least a part of an end portion of the second substrate is positioned on the first bonding member.

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