18151731. FAN-OUT SEMICONDUCTOR PACKAGES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
FAN-OUT SEMICONDUCTOR PACKAGES
Organization Name
Inventor(s)
FAN-OUT SEMICONDUCTOR PACKAGES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18151731 titled 'FAN-OUT SEMICONDUCTOR PACKAGES
Simplified Explanation
The abstract describes a fan-out semiconductor package that includes a frame substrate with a through hole, a semiconductor chip placed in the through hole, an encapsulation layer on the chip's side surfaces, and a guard ring on the chip's passivation layer and edge portion.
- The semiconductor chip is placed within a through hole in a frame substrate.
- The chip includes a chip body, a chip pad, and a passivation layer.
- An encapsulation layer is applied to the side surfaces of the chip within the through hole.
- A guard ring is formed on the passivation layer and the edge portion of the chip body.
Potential Applications
- This technology can be applied in various electronic devices that require compact and efficient semiconductor packaging.
- It can be used in smartphones, tablets, laptops, and other portable electronic devices.
- It can also be utilized in automotive electronics, medical devices, and industrial equipment.
Problems Solved
- The fan-out semiconductor package solves the problem of limited space in electronic devices by providing a compact packaging solution.
- It addresses the need for efficient heat dissipation and protection of the semiconductor chip.
- The guard ring helps to prevent damage to the chip and enhance its reliability.
Benefits
- The fan-out semiconductor package offers a smaller form factor compared to traditional packaging methods.
- It provides improved thermal management, ensuring the chip operates at optimal temperatures.
- The encapsulation layer and guard ring offer enhanced protection against environmental factors and mechanical stress.
- The technology enables higher integration density and improved electrical performance.
Original Abstract Submitted
A fan-out semiconductor package includes a frame substrate having a through hole therein, a semiconductor chip in the through hole, wherein the semiconductor chip includes a chip body, a chip pad on a surface of the chip body and a passivation layer on the chip body and on the chip pad, an encapsulation layer on side surfaces of the semiconductor chip within the through hole, and a guard ring on the passivation layer and on an edge portion of the chip body.
