18150552. SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Sih-Hao Liao of New Taipei City (TW)
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18150552 titled 'SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
Simplified Explanation
The abstract describes a semiconductor device that includes multiple layers and a connector. The layers are made of polymers and conductive patterns, and they are placed between two dies. An adhesion promoter layer is used to enhance the connection between the polymer layer and the conductive pattern. The connector is placed in one of the polymer layers and is in direct contact with the second die and the conductive pattern.
- The semiconductor device includes multiple layers made of polymers and conductive patterns.
- An adhesion promoter layer is used to improve the connection between the polymer layer and the conductive pattern.
- The device includes a connector that is placed in one of the polymer layers.
- The connector is in direct contact with the second die and the conductive pattern.
Potential Applications
- Semiconductor manufacturing
- Electronics industry
- Integrated circuits
Problems Solved
- Improved adhesion between layers in a semiconductor device
- Enhanced electrical connection between different components
- Simplified manufacturing process
Benefits
- Stronger bond between layers, reducing the risk of delamination
- Improved electrical performance and reliability
- Streamlined manufacturing process, potentially reducing costs and time
Original Abstract Submitted
A semiconductor device includes a first die, a second die, a first redistribution layer (RDL) structure and a connector. The RDL structure is disposed between the first die and the second die and is electrically connected to the first die and the second die and includes a first polymer layer, a second polymer layer, a first conductive pattern and an adhesion promoter layer. The adhesion promoter layer is between and in direct contact with the second polymer layer and the first conductive pattern. The connector is disposed in the first polymer layer and in direct contact with the second die and the first conductive pattern.
