18149274. PHASE CHANGE MATERIAL (PCM) SWITCH HAVING LOW HEATER RESISTANCE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

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PHASE CHANGE MATERIAL (PCM) SWITCH HAVING LOW HEATER RESISTANCE

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Hai-Dang Trinh of Hsinchu (TW)

Fu-Ting Sung of Yangmei City (TW)

PHASE CHANGE MATERIAL (PCM) SWITCH HAVING LOW HEATER RESISTANCE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18149274 titled 'PHASE CHANGE MATERIAL (PCM) SWITCH HAVING LOW HEATER RESISTANCE

Simplified Explanation

The abstract describes an integrated chip (IC) with a phase change material (PCM) structure and a heating structure for efficient heat dissipation.

  • The IC includes a dielectric structure over a substrate.
  • A PCM structure is placed over the dielectric structure.
  • A first and second conductive structure are electrically coupled to the PCM structure.
  • A heating structure is located in the dielectric structure between the conductive structures, with a wider second surface for better heat dissipation.

Potential Applications

This technology could be used in:

  • High-performance computing systems
  • Data centers
  • Advanced electronic devices

Problems Solved

  • Efficient heat dissipation in integrated circuits
  • Improved performance and reliability of electronic devices

Benefits

  • Enhanced thermal management
  • Increased processing speeds
  • Extended lifespan of electronic components

Potential Commercial Applications

  • Semiconductor industry
  • Electronics manufacturing companies
  • Thermal management solutions providers

Possible Prior Art

One possible prior art could be the use of traditional heat sinks in electronic devices for heat dissipation.

Unanswered Questions

How does the heating structure affect the overall power consumption of the IC?

The heating structure may consume additional power for heat dissipation, but the efficiency gains in thermal management could offset this increase.

What are the potential challenges in integrating this technology into existing electronic devices?

Integrating this technology may require redesigning the layout of the IC, which could pose challenges in terms of compatibility and space constraints.


Original Abstract Submitted

Various embodiments of the present application are directed toward an integrated chip (IC). The IC comprises a dielectric structure disposed over a substrate. A phase change material (PCM) structure is disposed over the dielectric structure. A first conductive structure and a second conductive structure are disposed over and electrically coupled to the PCM structure. A heating structure is disposed in the dielectric structure and laterally between the first conductive structure and the second conductive structure. The heating structure has a first surface and a second surface opposite the first surface. The first surface faces the PCM structure. The first surface has a first width and the second surface has a second width that is greater than the first width.

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