18144637. POWER MODULE AND MANUFACTURING METHOD THEREOF simplified abstract (KIA CORPORATION)
Contents
- 1 POWER MODULE AND MANUFACTURING METHOD THEREOF
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 POWER MODULE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
POWER MODULE AND MANUFACTURING METHOD THEREOF
Organization Name
Inventor(s)
Kyoung Kook Hong of Hwaseong-Si (KR)
Su Bin Kang of Seomgnam-Si (KR)
Young Seok Kim of Seongnam-Si (KR)
POWER MODULE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 18144637 titled 'POWER MODULE AND MANUFACTURING METHOD THEREOF
Simplified Explanation
The patent application describes a power module and a manufacturing method that involve semiconductor chips, an insulating circuit board with an insulating layer and a first metal layer, and lead frames positioned between the semiconductor chips and the insulating circuit board.
- Semiconductor chips, insulating circuit board, and lead frames are key components of the power module.
- The insulating circuit board includes an insulating layer and a first metal layer on one surface.
- Lead frames are placed between the semiconductor chips and the insulating circuit board to facilitate connections.
Potential Applications
The technology described in the patent application could be applied in various industries such as electronics, automotive, renewable energy, and telecommunications.
Problems Solved
This technology helps in improving the efficiency and reliability of power modules by providing a robust and efficient method of connecting semiconductor chips.
Benefits
- Enhanced performance and reliability of power modules - Simplified manufacturing process - Improved thermal management
Potential Commercial Applications
"Advanced Power Module Manufacturing Technology for Enhanced Efficiency and Reliability"
Possible Prior Art
There may be prior art related to power module manufacturing processes involving semiconductor chips, insulating circuit boards, and lead frames. Further research is needed to identify specific examples.
Unanswered Questions
How does this technology compare to existing power module manufacturing methods?
The article does not provide a direct comparison with existing methods, leaving a gap in understanding the competitive advantages of this technology.
What are the specific industries that could benefit the most from this technology?
While the potential applications are mentioned broadly, a more detailed analysis of the target industries would provide valuable insights for potential investors or stakeholders.
Original Abstract Submitted
A power module and a manufacturing method include semiconductor chips, an insulating circuit board including an insulating layer and a first metal layer disposed on a first surface of the insulating layer, and lead frames disposed between the semiconductor chips and the insulating circuit board.
