18144637. POWER MODULE AND MANUFACTURING METHOD THEREOF simplified abstract (HYUNDAI MOTOR COMPANY)
Contents
- 1 POWER MODULE AND MANUFACTURING METHOD THEREOF
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 POWER MODULE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
POWER MODULE AND MANUFACTURING METHOD THEREOF
Organization Name
Inventor(s)
Kyoung Kook Hong of Hwaseong-Si (KR)
Su Bin Kang of Seomgnam-Si (KR)
Young Seok Kim of Seongnam-Si (KR)
POWER MODULE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 18144637 titled 'POWER MODULE AND MANUFACTURING METHOD THEREOF
Simplified Explanation
The patent application describes a power module and a manufacturing method that involve semiconductor chips, an insulating circuit board with an insulating layer and a first metal layer, and lead frames positioned between the semiconductor chips and the insulating circuit board.
- Semiconductor chips are a key component of the power module.
- The insulating circuit board includes an insulating layer and a first metal layer on one surface.
- Lead frames are placed between the semiconductor chips and the insulating circuit board.
Potential Applications
The technology described in this patent application could be applied in various industries such as automotive, renewable energy, consumer electronics, and industrial machinery.
Problems Solved
This technology helps in improving the efficiency and reliability of power modules by providing a secure and insulated connection between semiconductor chips and the circuit board.
Benefits
The benefits of this technology include enhanced performance, increased durability, and improved thermal management in power modules.
Potential Commercial Applications
The technology could be utilized in electric vehicles, solar inverters, smart appliances, and power supplies for industrial equipment.
Possible Prior Art
Prior art in this field may include existing power module designs with different configurations of semiconductor chips, insulating materials, and lead frame arrangements.
Unanswered Questions
How does this technology compare to existing power module designs in terms of cost-effectiveness?
The article does not provide information on the cost implications of implementing this technology compared to other power module designs.
What specific industries or applications would benefit the most from this technology?
The article does not specify which industries or applications would see the greatest advantages from using this power module technology.
Original Abstract Submitted
A power module and a manufacturing method include semiconductor chips, an insulating circuit board including an insulating layer and a first metal layer disposed on a first surface of the insulating layer, and lead frames disposed between the semiconductor chips and the insulating circuit board.
