18143735. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18143735 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The abstract describes a semiconductor package that includes a package substrate with two regions and two surfaces, a semiconductor chip mounted on the substrate, a pad with two sub-pads on each region's surface, and a solder ball on the second surface. The solder ball consists of two sub-solder balls, with one connected to each sub-pad. The second sub-solder ball has two portions, with one portion in a recess and the other portion on top of it.
- The semiconductor package includes a package substrate, semiconductor chip, pad, and solder ball.
- The package substrate has two regions and two opposing surfaces.
- The pad has two sub-pads, one on each region's surface.
- The solder ball is placed on the second surface and consists of two sub-solder balls.
- The first sub-solder ball is connected to the first sub-pad.
- The second sub-solder ball is connected to the second sub-pad and has two portions.
- The first portion of the second sub-solder ball is in a recess.
- The second portion of the second sub-solder ball is on top of the first portion.
Potential Applications:
- This semiconductor package design can be used in various electronic devices that require reliable connections between the semiconductor chip and the package substrate.
- It can be applied in mobile devices, computers, automotive electronics, and other electronic systems.
Problems Solved:
- The design provides a secure and reliable connection between the semiconductor chip and the package substrate.
- It ensures proper electrical and thermal conductivity between the chip and the substrate.
- The recess in the second sub-solder ball allows for better alignment and stability during assembly.
Benefits:
- Improved reliability and durability of the semiconductor package.
- Enhanced electrical and thermal performance.
- Simplified assembly process due to the recess in the second sub-solder ball.
Potential Applications
- Mobile devices
- Computers
- Automotive electronics
- Other electronic systems
Problems Solved
- Secure and reliable connection between semiconductor chip and package substrate
- Improved electrical and thermal conductivity
- Better alignment and stability during assembly
Benefits
- Increased reliability and durability of the semiconductor package
- Enhanced electrical and thermal performance
- Simplified assembly process
Original Abstract Submitted
A semiconductor package includes: a package substrate including a first region, a second region, a first surface, and a second surface opposing the first surface; a semiconductor chip mounted on the package substrate; a pad including a first sub-pad, which is disposed on the second surface of the first region, and a second sub-pad, which is disposed on the second surface of the second region and includes a solder ball recess; and a solder ball disposed on the second surface, wherein the solder ball includes a first sub-solder ball and a second sub-solder ball, wherein the first sub-solder ball is connected to the first sub-pad, and the second sub-solder ball is connected to the second sub-pad, wherein the second sub-solder ball includes a first portion and a second portion, wherein the first portion is disposed in the solder ball recess, and the second portion is disposed on the first portion.
