18142876. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18142876 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The patent application describes a semiconductor package that includes multiple semiconductor chips and metal posts for electrical connections. The metal posts are arranged in two layers, with the first layer spaced apart around the first semiconductor chip and the second layer spaced apart around the first layer. The first layer of metal posts has a wider width than the second layer.
- The semiconductor package includes multiple semiconductor chips and metal posts for electrical connections.
- The metal posts are arranged in two layers, with the first layer spaced apart around the first semiconductor chip and the second layer spaced apart around the first layer.
- The first layer of metal posts has a wider width than the second layer.
Potential Applications
- This semiconductor package can be used in various electronic devices that require multiple semiconductor chips to be connected together.
- It can be applied in industries such as telecommunications, computing, automotive, and consumer electronics.
Problems Solved
- The arrangement of metal posts in two layers allows for efficient electrical connections between multiple semiconductor chips.
- The wider width of the first layer of metal posts provides better electrical conductivity and stability.
Benefits
- The semiconductor package provides a compact and efficient solution for connecting multiple semiconductor chips.
- The wider width of the first layer of metal posts improves the electrical performance and reliability of the package.
- The design allows for better heat dissipation and overall performance of the semiconductor package.
Original Abstract Submitted
A semiconductor package includes; a first semiconductor chip, a second semiconductor chip on the first semiconductor chip, a redistribution structure below the first semiconductor chip, and metal posts around the first semiconductor chip, extending between the redistribution structure and the second semiconductor chip, and electrically connecting the second semiconductor chip and redistribution structure, wherein the metal posts include an arrangement of first metal posts spaced apart around the first semiconductor chip, and an arrangement of second metal posts spaced apart around the arrangement of first metal posts, and each of the first metal posts in the arrangement of first metal posts includes a portion having a width greater than a width of each of the second metal posts.
