18141690. IMAGE PROCESSING METHOD AND SYSTEM THEREOF simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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IMAGE PROCESSING METHOD AND SYSTEM THEREOF

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Min Su Kang of Suwon-si (KR)

Jang Hoon Kim of Suwon-si (KR)

Woo Jin Jung of Suwon-si (KR)

IMAGE PROCESSING METHOD AND SYSTEM THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 18141690 titled 'IMAGE PROCESSING METHOD AND SYSTEM THEREOF

Simplified Explanation

The patent application describes an image processing system that analyzes images of a semiconductor device taken from different directions. The system includes an input interface to receive images from two different directions, a processor to perform edge detection and image binarization operations on the images, and a learning device to compare line widths obtained from the images and learn the optimal conditions for image binarization.

  • The system receives two images of a semiconductor device from different directions.
  • The processor performs edge detection and image binarization on the first direction image.
  • The learning device compares the line widths obtained from the image binarization and the second direction image.
  • The learning device learns the conditions for image binarization that maximize the correlation between the line widths.

Potential applications of this technology:

  • Quality control in semiconductor manufacturing: The system can be used to analyze images of semiconductor devices and detect any defects or abnormalities in their structure.
  • Process optimization: By learning the optimal conditions for image binarization, the system can help optimize the manufacturing process and improve the overall quality and efficiency.

Problems solved by this technology:

  • Accurate edge detection: The system's edge detection operation helps in accurately identifying the edges of the semiconductor device, which is crucial for further analysis and defect detection.
  • Line width measurement: By comparing line widths obtained from different directions, the system can provide accurate measurements of the device's features, which is important for quality control and process optimization.

Benefits of this technology:

  • Improved quality control: The system's ability to detect defects and abnormalities in semiconductor devices can help ensure that only high-quality products are released to the market.
  • Enhanced process efficiency: By optimizing the image binarization operation, the system can improve the efficiency of the manufacturing process, reducing waste and increasing productivity.


Original Abstract Submitted

An image processing system, including an input interface configured to receive a first direction image corresponding to a view of a semiconductor device in a first direction, and a second direction image corresponding to a view of the semiconductor device in a second direction which intersects the first direction at a first height at which the first direction image is generated; a processor configured to perform an edge detection operation for detecting an edge based on the first direction image, and to perform an image binarization operation on the first direction image; and a learning device configured to compare a first line width obtained based on the image binarization operation, and a second line width obtained based on the second direction image through machine learning, and to learn a condition of the image binarization operation which maximizes a correlation between the first line width and the second line width.