18141295. MANUFACTURING METHOD OF IMAGE SENSOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
MANUFACTURING METHOD OF IMAGE SENSOR PACKAGE
Organization Name
Inventor(s)
MANUFACTURING METHOD OF IMAGE SENSOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18141295 titled 'MANUFACTURING METHOD OF IMAGE SENSOR PACKAGE
Simplified Explanation
The patent application describes a method of manufacturing an image sensor package. The method involves several steps, including preparing a device wafer with multiple chip portions and a scribe lane, forming a redistribution insulating film on the lower surface of the device wafer, forming a redistribution pattern on the lower surface of the device wafer, placing a preliminary transparent substrate on the upper surface of the device wafer, performing a laser bonding process, and performing a singulation process to form individual image sensor packages.
- The method involves preparing a device wafer with multiple chip portions and a scribe lane.
- A redistribution insulating film is formed on the lower surface of the device wafer to cover a redistribution pattern and a portion of the redistribution pattern.
- A redistribution pattern is formed on the lower surface of the device wafer and a redistribution insulating film is applied to cover a portion of the redistribution pattern.
- A preliminary transparent substrate is placed on the upper surface of the device wafer where a preliminary dam pattern is formed.
- A laser bonding process is performed by radiating a laser beam to the preliminary dam pattern.
- A singulation process is performed to form individual image sensor packages.
Potential Applications
- Manufacturing image sensor packages for various electronic devices such as smartphones, digital cameras, and surveillance systems.
Problems Solved
- Provides a method for manufacturing image sensor packages with improved efficiency and accuracy.
- Simplifies the manufacturing process by using a laser bonding process and singulation process.
Benefits
- Increases the production efficiency of image sensor packages.
- Improves the accuracy and reliability of the manufacturing process.
- Reduces the manufacturing costs by simplifying the process.
Original Abstract Submitted
Provided is a method of manufacturing an image sensor package, the method including preparing a device wafer including a plurality of chip portions and a scribe lane, forming a redistribution insulating film on a lower surface of the device wafer to cover a redistribution pattern and a portion of the redistribution pattern and to cover a lower surface of the device wafer, forming a redistribution pattern on a lower surface of the device wafer and a redistribution insulating film to cover a portion of the redistribution pattern and to cover a lower surface of the device wafer, placing a preliminary transparent substrate on an upper surface of the device wafer on which the preliminary dam pattern is formed, performing a laser bonding process of radiating a laser beam to the preliminary dam pattern, and performing a singulation process forming individual image sensor packages.
