18140343. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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SEMICONDUCTOR PACKAGE

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Su Jung Hyung of Suwon-si (KR)

SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18140343 titled 'SEMICONDUCTOR PACKAGE

Simplified Explanation

The abstract of this patent application describes a semiconductor package that includes a substrate, at least one semiconductor chip on the upper surface of the substrate, a molding layer on a portion of the sidewall of the semiconductor chip, and a heat dissipation member with at least one trench that contacts the upper surface and another portion of the sidewall of the semiconductor chip.

  • The semiconductor package includes a substrate, which provides a foundation for the other components.
  • At least one semiconductor chip is placed on the upper surface of the substrate, allowing for electronic functionality.
  • A molding layer is applied to a portion of the sidewall of the semiconductor chip, providing protection and stability.
  • The heat dissipation member consists of at least one trench that makes contact with both the upper surface and another portion of the sidewall of the semiconductor chip, facilitating heat dissipation.

Potential applications of this technology:

  • Semiconductor packages are widely used in electronic devices such as smartphones, computers, and automotive electronics.
  • This innovation can be applied in various industries that require efficient heat dissipation, such as telecommunications, aerospace, and power electronics.

Problems solved by this technology:

  • Heat dissipation is a critical issue in semiconductor devices, as excessive heat can lead to performance degradation and even failure.
  • The heat dissipation member with trenches helps to efficiently dissipate heat from the semiconductor chip, preventing overheating and ensuring optimal performance.

Benefits of this technology:

  • Improved heat dissipation capabilities enhance the overall performance and reliability of semiconductor devices.
  • The molding layer provides additional protection to the semiconductor chip, reducing the risk of damage.
  • The design of the heat dissipation member allows for effective cooling without the need for additional cooling mechanisms, reducing complexity and cost.


Original Abstract Submitted

A semiconductor package includes a substrate, at least one semiconductor chip provided on an upper surface of the substrate, a molding layer provided on a portion of a sidewall of the at least one semiconductor chip, and a heat dissipation member comprising at least one trench that contacts an upper surface of the at least one semiconductor chip and another portion of the sidewall of the at least one semiconductor chip.

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