18137595. POWER MODULE FOR VEHICLE simplified abstract (HYUNDAI MOTOR COMPANY)
Contents
- 1 POWER MODULE FOR VEHICLE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 POWER MODULE FOR VEHICLE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
POWER MODULE FOR VEHICLE
Organization Name
Inventor(s)
Jun Hee Park of Hwaseong-Si (KR)
Nam Sik Kong of Hwaseong-Si (KR)
POWER MODULE FOR VEHICLE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18137595 titled 'POWER MODULE FOR VEHICLE
Simplified Explanation
The patent application describes a power module for a vehicle that includes two substrates with metal circuits, spacers, and a semiconductor chip with power and signal pads.
- First substrate with a metal circuit on one surface and a spacer extending in one direction
- Second substrate facing the first substrate with a metal circuit on a surface facing the first substrate and a spacer extending in the opposite direction
- Semiconductor chip placed between the substrates with power and signal pads
- Spacers from both substrates extend towards each other, with the second spacer connected to the power and signal pads
Potential Applications
The technology described in this patent application could be applied in electric vehicles, hybrid vehicles, and other automotive systems requiring power modules for efficient energy management.
Problems Solved
This technology solves the problem of efficiently managing power distribution in vehicles, ensuring optimal performance and reliability of the power module.
Benefits
The benefits of this technology include improved power efficiency, compact design, and enhanced thermal management in vehicle power systems.
Potential Commercial Applications
The technology could be commercially applied in electric vehicle manufacturing, automotive component production, and other industries requiring advanced power module solutions.
Possible Prior Art
One possible prior art for this technology could be existing power module designs for vehicles, although the specific configuration and features described in this patent application may offer unique advantages.
Unanswered Questions
How does this technology compare to traditional power module designs in terms of efficiency and performance?
The article does not provide a direct comparison between this technology and traditional power module designs, leaving the reader to speculate on the potential advantages or disadvantages.
Are there any specific vehicle models or manufacturers interested in implementing this technology?
The article does not mention any specific partnerships or collaborations with vehicle manufacturers, leaving the reader curious about the potential market adoption of this technology.
Original Abstract Submitted
A power module for a vehicle, includes: a first substrate including a first metal circuit disposed on a 1-1st surface, and a first spacer extending from the first metal circuit in a first direction; a second substrate spaced from and facing the first substrate in a second direction, and including a second metal circuit disposed on a 2-1st surface facing the 1-1st surface, and a second spacer extending from the second metal circuit in the second direction; and a semiconductor chip disposed between the first substrate and the second substrate and including a power pad and a signal pad, the first spacer and the second spacer extending toward each other, and the second spacer including a 2-1st spacer connected to the power pad and a 2-2nd spacer connected to the signal pad.
