18134731. TERAHERTZ PROBE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

TERAHERTZ PROBE

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Martin Priwisch of Suwon-si (KR)

Alexander Michalski of Aachen (DE)

Michael Nagel of Aachen (DE)

Namil Koo of Suwon-si (KR)

Suhwan Park of Suwon-si (KR)

Junbum Park of Suwon-si (KR)

Inkeun Baek of Suwon-si (KR)

Jongmin Yoon of Suwon-si (KR)

Yoonkyung Jang of Suwon-si (KR)

Ikseon Jeon of Suwon-si (KR)

TERAHERTZ PROBE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18134731 titled 'TERAHERTZ PROBE

Simplified Explanation

The abstract describes a cantilever device that includes conductive lines, a microtip, and an emitter antenna. The emitter antenna is connected to the conductive lines and produces a scattering signal of a terahertz wave band. The emitter antenna consists of three emitter electrodes and a scattering part that connects two of the electrodes.

• The cantilever device includes conductive lines, a microtip, and an emitter antenna.
• The emitter antenna is connected to the conductive lines and produces a scattering signal of a terahertz wave band.
• The emitter antenna consists of three emitter electrodes and a scattering part that connects two of the electrodes.

Potential applications of this technology:

• Terahertz wave imaging and spectroscopy
• Non-destructive testing and inspection
• Wireless communication and data transfer

Problems solved by this technology:

• Improved terahertz wave generation and scattering
• Enhanced sensitivity and resolution in terahertz wave detection
• Simplified fabrication and integration of terahertz devices

Benefits of this technology:

• Higher quality terahertz wave signals for various applications
• Increased efficiency and accuracy in terahertz wave detection
• Cost-effective and scalable manufacturing process for terahertz devices

Original Abstract Submitted

According to embodiments, a cantilever is provided. The cantilever includes a first conductive line, a second conductive line, and a third conductive line extending on the substrate, a microtip arranged on the substrate, and an emitter antenna arranged on the microtip, connected to the first to third conductive lines, and configured to produce a scattering signal of a terahertz wave band, wherein the emitter antenna includes a first emitter electrode connected to the first conductive line, a second emitter electrode connected to the second conductive line and adjacent to the first emitter electrode, a third emitter electrode connected to the third conductive line and spaced apart from the first emitter electrode with the second emitter electrode in-between, and a scattering part connecting the first and second emitter electrodes with each other.