18134314. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Sangwook Park of Suwon-si (KR)
Sangnam Jeong of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18134314 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package includes a base substrate with two packages mounted on the upper surface, each containing connection pads corresponding to a package ball map with cells arranged in rows and columns.
- The second package includes connection pads with signals such as data signals and command or address signals.
- The package ball map includes a first signal (data signal) and a second signal (command or address signal) arranged separately.
Potential Applications
- Semiconductor industry for electronic devices.
- Communication systems for data processing.
Problems Solved
- Efficient signal routing and management.
- Improved connectivity and data transfer.
Benefits
- Enhanced performance and reliability.
- Simplified design and assembly process.
Original Abstract Submitted
Provided is a semiconductor package including a base substrate, and a first package and a second package mounted apart from each other on an upper surface of the base substrate in a horizontal direction, wherein the second package includes, on each surface thereof, connection pads corresponding to a package ball map including cells, arranged in a plurality of rows and a plurality of columns, each of which has one signal arranged therein, wherein the package ball map includes a first signal, or a data signal, arranged in at least some cells among the cells of the package ball map, and a second signal, or a command or address signal, and the first signal is arranged apart from the second signal.
