18133141. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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SEMICONDUCTOR PACKAGE

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Taeyoung Lee of Suwon-si (KR)

SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18133141 titled 'SEMICONDUCTOR PACKAGE

Simplified Explanation

The abstract of the patent application describes a semiconductor package that includes a first semiconductor chip with multiple first through-electrodes and first shared electrodes. The first through-electrodes are arranged in a specific direction.

  • The semiconductor package includes a first semiconductor chip with multiple first through-electrodes and first shared electrodes.
  • The first through-electrodes are arranged in a specific direction.
  • The first shared electrodes are also present in the first semiconductor chip.
  • The abstract does not provide further details about the specific arrangement or purpose of the electrodes.

Potential Applications:

  • This semiconductor package could be used in various electronic devices such as smartphones, tablets, computers, and other consumer electronics.
  • It may find applications in automotive electronics, industrial automation, and telecommunications equipment.

Problems Solved:

  • The semiconductor package provides a compact and efficient solution for connecting the first semiconductor chip to external components.
  • It allows for improved signal transmission and reduced power consumption.
  • The specific arrangement of the first through-electrodes may address issues related to signal interference or cross-talk.

Benefits:

  • The semiconductor package offers a higher level of integration and miniaturization, enabling smaller and more advanced electronic devices.
  • It provides improved electrical performance and reliability.
  • The specific arrangement of the first through-electrodes may enhance the overall functionality and efficiency of the semiconductor chip.


Original Abstract Submitted

A semiconductor package includes: a first semiconductor chip including a plurality of first through-electrodes and a plurality of first shared electrodes, wherein the first through-electrodes are arranged in a first direction, wherein the plurality of first shared.

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