18132420. SPUTTERING TARGET AND SPUTTERING APPARATUS INCLUDING THE SAME simplified abstract (Samsung Display Co., Ltd.)
Contents
- 1 SPUTTERING TARGET AND SPUTTERING APPARATUS INCLUDING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SPUTTERING TARGET AND SPUTTERING APPARATUS INCLUDING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SPUTTERING TARGET AND SPUTTERING APPARATUS INCLUDING THE SAME
Organization Name
Inventor(s)
HYUNEOK Shin of Yongin-si (KR)
JOONYONG Park of Yongin-si (KR)
SPUTTERING TARGET AND SPUTTERING APPARATUS INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18132420 titled 'SPUTTERING TARGET AND SPUTTERING APPARATUS INCLUDING THE SAME
Simplified Explanation
The sputtering target described in the patent application includes a first target part and a second target part, both made of a metal oxide and adjacent to each other, with a target dividing part containing the same metal element as the first and second target parts. This design allows for increased size and/or length of the sputtering target, improving manufacturing efficiency and reducing costs. It also prevents stains on the target substrate caused by non-uniform sputtering of metal elements and ensures the uniformity of thin film deposition.
- Increased size and/or length of sputtering target
- Improved manufacturing efficiency and cost reduction
- Prevention of stains on target substrate
- Ensuring uniformity of thin film deposition
Potential Applications
The technology can be applied in various industries where thin film deposition is required, such as semiconductor manufacturing, solar panel production, and optical coatings.
Problems Solved
- Non-uniform sputtering of metal elements causing stains on target substrate - Lack of uniformity in thin film deposition
Benefits
- Improved manufacturing efficiency - Cost reduction - Enhanced quality of thin film deposition
Potential Commercial Applications
"Enhancing Thin Film Deposition Efficiency in Semiconductor Manufacturing"
Possible Prior Art
One possible prior art could be the use of target materials with uniform composition throughout, which may not achieve the same level of efficiency and uniformity as the design described in the patent application.
Unanswered Questions
How does the technology impact the overall performance of the sputtering process?
The article does not delve into the specific performance improvements that the technology brings to the sputtering process.
Are there any limitations to the size increase of the sputtering target using this design?
The article does not mention any potential limitations or constraints on the size increase of the sputtering target.
Original Abstract Submitted
A sputtering target includes a first target part and a second target part both including a metal oxide and adjacent to each other and a target dividing part disposed between a first target part and a second target part. The target dividing part includes a same metal element as a metal element included in a first target part and a second target part. Therefore, size and/or length of the sputtering target may be increased. Thus, efficiency of a manufacturing process of the sputtering target is improved and a manufacturing cost is reduced. In addition, even after a thin film is deposited on a target substrate using the sputtering target, stains caused by sputtering of non-uniform amounts of metal elements by location on the target substrate do not occur on a target substrate. In addition, the uniformity of a thin film deposited on a target substrate is secured by using the sputtering target. Thus, process quality of a sputtering process is improved.
